Ansys Multiphysics Solutions Achieve Certification for TSMC's N3E and N4P Process Technologies
June 24, 2022 | PRNewswireEstimated reading time: 1 minute
Ansys and TSMC extended their long-standing collaboration to achieve certification of Ansys' power integrity software for TSMC's industry-leading N4P and N3E process technologies. The certification for Ansys RedHawk-SC and Totem enables next generation silicon designs for machine learning, 5G mobile, and high-performance computing (HPC) applications. This latest collaboration builds on the recent certification of the Ansys platform for TSMC's N4 and N3 processes.
"Our latest collaboration with Ansys provides our mutual customers with design solutions benefiting from the significant power and performance improvements of our latest advanced technologies," said Suk Lee, vice president of the Design Infrastructure Management Division at TSMC. "We work closely with our ecosystem partners to ensure our customers have timely and reliable power integrity design and analysis solutions available to accelerate innovation for their differentiated products."
Ansys RedHawk-SC and Ansys Totem are consistently among the most popular choices for power integrity verification in many of the world's leading chip design projects. The industry-leading solutions enable designers to sign off voltage-drop, power noise, and electromigration reliability down to 3nm with predictive accuracy. The powerful analytics quickly help identify weaknesses and allow what-if explorations to help optimize power and performance.
"Ansys has developed an integrated software platform of multiphysics simulation and analysis tools that quickly solve the power management challenges inherent in today's ultra-large and complex chip designs," said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. "Our partnership with TSMC keeps Ansys products at the forefront of silicon technology and helps designers realize the greatest possible benefit from the latest process innovations."
Suggested Items
Sondrel Awarded New Video Processor ASIC Design and Supply Contract
05/09/2024 | SondrelSondrel, a leading provider of ultra-complex custom chips for leading global technology brands, is pleased to announce that it has won a major ASIC design and supply contract for a next generation, video processing chip.
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Siemens Delivers New Solido IP Validation Suite
05/07/2024 | SiemensSiemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/07/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.