New Unified Qualcomm AI Stack Portfolio Revolutionizes Developer Access, Extends AI Leadership
June 27, 2022 | Qualcomm Technologies, Inc.Estimated reading time: 2 minutes

Qualcomm Technologies, Inc. announced Qualcomm® AI Stack portfolio, accelerating the company’s leadership in artificial intelligence (AI) and the Connected Intelligent Edge. Combining and improving its best-in-class AI software offerings, Qualcomm AI Stack is a comprehensive AI solution for OEMs and developers, supporting a wide range of intelligent devices with broad AI software access and compatibility. For the first time, a single AI software portfolio works across Qualcomm Technologies-powered devices, spanning the wide range of Connected Intelligent Edge products – including mobile, automotive, XR, compute, IoT, and cloud platforms.
Qualcomm AI Stack supports different AI frameworks and popular runtimes including TensorFlow, PyTorch and ONNX, developer libraries and services, system software, tools, and compilers so that any AI feature developed for one device can easily be deployed on others.
“This comprehensive Qualcomm AI Stack portfolio is a truly revolutionary step in improving AI development for OEMs and developers and achieving high performance across our product portfolio,” said Ziad Asghar, vice president of product management, Qualcomm Technologies, Inc. “We’re delighted to extend our one technology roadmap with this new portfolio and expand our leadership in the Connected Intelligent Edge.”
This comprehensive portfolio provides direct access to the Qualcomm® AI Engine and dedicated AI cores on Qualcomm® Cloud AI 100 using Qualcomm® AI Engine direct. As part of the new offering, the Qualcomm AI Engine direct will now scale across every AI accelerator inside a comprehensive range of Qualcomm Technologies products. Qualcomm AI Engine direct is an AI library that delegates and deploys existing models directly to the AI accelerators on Qualcomm Technologies platforms and will now provide OEMs and developers the ability to develop one feature, then move the same model across different products and tiers.
“Qualcomm Technologies continues to deliver advanced AI solutions that make it easier for developers to leverage today’s most powerful AI and ML capabilities,” said Yuan Yu, Distinguished Engineer for AI Frameworks Architecture at Microsoft. “We’re enthusiastic to bring Qualcomm AI Software technologies to developers in our ecosystems, including the Qualcomm Neural Processing SDK for Windows, to offer edge-to-cloud AI capabilities by providing unified, comprehensive AI software that scales from clients to servers.”
The Qualcomm AI Stack portfolio will also include a suite of tools, including Qualcomm® AI Model Efficiency Toolkit (AIMET), AI development graphical user interface (GUI), model analyzers to foster enhanced quantization and optimization, and Neural Architecture Search (NAS). As announced at Snapdragon Tech Summit 2021, Qualcomm Technologies and Google Cloud integrated Google Cloud Vertex AI NAS, which enables OEMs and the ecosystem to create, test, and deploy unique and efficient experiences on the edge. The Qualcomm Neural Processing SDK remains a key product for OEMs and developers to run their neural networks on a broad range of Qualcomm Technologies’ products and will continue to receive regular updates and support. This collective will give Qualcomm Technologies a baseline to create domain-specific SDKs to deploy across the Connected Intelligent Edge.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Würth Elektronik Participates in EU Initiative PROACTIF for Cutting-edge Drone and Robotics Solutions
10/14/2025 | Wurth ElektronikWürth Elektronik is a partner in the visionary EU project PROACTIF, funded under the Chips Joint Undertaking (Chips JU). The international consortium of 42 partners from 13 countries aims to strengthen Europe’s technological sovereignty i
Dymax to Address Key Electronics Assembly Challenges with Light-Cure Solutions at SMTA International 2025
10/09/2025 | DymaxDymax, a global manufacturer of light-curing materials and equipment, will exhibit at SMTA International 2025 in Rosemont, Illinois, October 21–23. Visit booth 2834 to see how Dymax technologies protect components from harsh environments, help meet regulatory requirements, and streamline assembly.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
The Power Integrity Issue: Design007 Magazine October 2025
10/08/2025 | I-Connect007 Editorial TeamAs technologies such as chiplets and 3D-IC continue to proliferate, solid knowledge of PI design techniques will become a critical tool in your toolbox. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
AT&S Plans Entry Into the Defense Sector
10/02/2025 | AT&SIn times of global uncertainty and geopolitical tension, AT&S is expanding its portfolio to include the defense sector. As a globally leading provider of high-end IC substrates and printed circuit boards, the company is responding to growing demand for security-relevant solutions and emphasizing its social responsibility. This demand will be addressed from its site in Leoben, Austria.