The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
Smart Automation: AI—Revolutionizing Inspection in Electronics Manufacturing
Standard of Excellence: The Role of Technology in Enhancing the Customer Experience
Seika Machinery’s Malcom Wetting Balance Tester Takes Testing a Step Further
July 8, 2022 | Seika Machinery, Inc.Estimated reading time: Less than a minute
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, takes the “Dip & Look” method to the next level. The Malcom SWB-2 Wetting Balance Tester measures the wetting forces during the soldering process.
The tester has been designed to evaluate the effectiveness of different solder and flux combinations on a standardized test coupon, or your own test pieces. The entire procedure from flux application (with flux temperature control function) to measurement end is automated.
The SWB-2 can be programmed with desired insertion depth, speed, time and temperature, conforming to JIS and IPC J-STD testing protocols. This allows users to evaluate the wetting force in a controlled and repeatable environment. The three-stage process includes a fluxing station, excess flux dab and solder pot dip. The included software allows users to see, analyze, compare and log the test results.
The automated tester reduces unstable measurement results and user error with automatic measurement in compliance with JIS Z3195. The system makes it simple to change solder and flux when necessary. Additionally, the wetting balance method is an available option that adds the ability to measure micro parts such as 0402s.
Share on:
Suggested Items
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.