Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Seika Machinery’s Malcom Wetting Balance Tester Takes Testing a Step Further
July 8, 2022 | Seika Machinery, Inc.Estimated reading time: Less than a minute
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, takes the “Dip & Look” method to the next level. The Malcom SWB-2 Wetting Balance Tester measures the wetting forces during the soldering process.
The tester has been designed to evaluate the effectiveness of different solder and flux combinations on a standardized test coupon, or your own test pieces. The entire procedure from flux application (with flux temperature control function) to measurement end is automated.
The SWB-2 can be programmed with desired insertion depth, speed, time and temperature, conforming to JIS and IPC J-STD testing protocols. This allows users to evaluate the wetting force in a controlled and repeatable environment. The three-stage process includes a fluxing station, excess flux dab and solder pot dip. The included software allows users to see, analyze, compare and log the test results.
The automated tester reduces unstable measurement results and user error with automatic measurement in compliance with JIS Z3195. The system makes it simple to change solder and flux when necessary. Additionally, the wetting balance method is an available option that adds the ability to measure micro parts such as 0402s.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.