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STI Offers Prototype Development
July 12, 2022 | STI Electronics, Inc.Estimated reading time: 1 minute
STI Electronics, Inc., a full-service organization including engineering, contract manufacturing and training services, is a complete partner from schematic forward design through first article validation. A key step in this cycle is the prototype development process. Prototypes are a requirement in the design validation step and often consume more funding and time than initially budgeted. STI’s unique prototype development approach mitigates these expenses and reduces the overall time to market for customers’ new products.
The typical approach to prototype development is to design, check, build and evaluate. Upon completion of the evaluation, boards are “re spun” to implement changes desired, thus adding time and money to the development cycle. STI’s approach is different with the company’s objective focused on the implementation of corrective actions via rework and repair per IPC 7711/21 (STI is an approved development center for IPC 7711/21) to get the first prototype to the customer’s desired “production” performance level. The product can be released for beta build and test once this milestone is achieved.
STI’s prototype development approach reduces the overall cost and time to market by compressing the development stages from as many as 3 cycles to as few as 1 cycle. The prototype development process is complimented by the capabilities in the company’s analytical lab. The prototype can be subjected to environmental and analytical tests as required to ensure system design objectives are met. These include but are not limited to thermal shock, vibration, humidity, etc. STI’s tests can be performed to customer-supplied specifications or a customized test plan based on best practices learned over the years. The company also has the ability to test prototypes to failure to provide feedback as to finding the weakest link in the design.
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05/09/2025 | Andy Shaughnessy, Design007 MagazineTrade show season is wrapping up as we head into summer. Where has the time gone? I hope you all get the chance to take a vacation this year, because I know you’ve earned one. Speaking of which, when was my last vacay? If I can’t remember, it’s probably time for one. It’s been a busy week in electronics, with fallout from the back-and-forth on tariffs taking up most of the oxygen in the room. We have quite an assortment of articles and columns for you in this installment of Must-Reads. See you next time.
Imec Coordinates EU Chips Design Platform
05/09/2025 | ImecA consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform.
New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial TeamWhy is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.