-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSupply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Indium Corporation to Feature LED Products at MiniLED Seminar
July 13, 2022 | Indium CorporationEstimated reading time: 2 minutes
Indium Corporation will feature its proven, innovative products for LED manufacturing at the Mini LED Backlight Mass Production and Application Trend Conference, Thursday, July 28 in Shenzhen, China.
Indium Corporation produces a wide range of products to meet the current and evolving needs of the industry. As mini-LEDs are increasingly used in displays for consumer electronics at home and in external displays due to their superior contrast ratios, deep blacks, and high dynamic ranges.
Indium Corporation’s suite of semiconductor and advanced assembly materials is ideal for Mini-LED assembly and the small pad sizes and tight pitches required in their assembly.
Solder paste solutions to be featured include:
- LEDPaste NC38HF, a no-clean, halogen-free solder paste specifically formulated to accommodate fine feature printing, especially for mini- or micro-LED applications. This new product will be released at the show and combines superior wetting performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements for the smallest LED applications. It also delivers high tackiness and is available in a wide range of alloys, including Ag-free options.
- Indium12.8HF, a no-clean, halogen-free microdispensing solder paste that is inherently compatible with Indium Corporation’s best-selling solder paste—Indium8.9HF—and is optimized for long-term jetting and microdispense applications. Originally formulated for micro-LED applications, Indium12.8HF has proven to be useful in a wide range of applications requiring precision dot diameter/line width deposits down to 80?m.
- Indium3.2HF is a water-soluble, halogen-free, Pb-free solder paste. Indium3.2HF formulated with Indium Corporation’s Type 6 SGS powder is ideal for fine feature printing applications. It also offers consistent, repeatable printing performance combined with a long stencil life.
Flux solutions to be featured include:
- NC-809, an award-winning, halogen-free, ultra-low residue, flip-chip flux designed to hold die or solder spheres in place without risk of die shift during the assembly process. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes.
- WS-829 is a wafer-level ball-attach flux is a water-soluble, halogen-free flux that can be used for ball-attach on substrate in a standard BGA manufacturing process (especially for the smallest sphere applications < 0.25mm) as well as wafer-/panel-level packaging. It is designed for printing and pin transfer applications for the smallest sphere and high-density applications, including LED die-attach.
- LED TACFlux® 007 is the leading die-attach flux for LED industry. Specifically designed for die-to-sub-mount applications with sputtered film or solder preform alloys, it provides melting points that range from tin-silver (SnAg), SAC (SnAgCu) and pure tin (Sn) up to gold-tin (AuSn) eutectic. It may be applied using various application techniques, holds the die in place during reflow, and is easily cleaned to give high wire bond pull-strengths.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007e book library here.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Indium Promotes Huang to Senior Manager, Marketing Communications
08/28/2025 | Indium CorporationWith its commitment to innovation and growth through employee development, Indium Corporation announces the promotion of Jingya Huang to Senior Manager, Marketing Communications, to continue to lead the company’s branding and promotional efforts.
Rehm Academy Expands Its Training Program
08/28/2025 | Rehm Thermal SystemsThe demands on modern industrial companies and employees continue to rise, and therefore, the topic of further education is becoming increasingly important today.
MacDermid Alpha Awarded for Innovation: Driving Process Optimization and Efficiency with Major Indian EMS Provider
08/28/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, a leading global supplier of integrated materials for the electronics industry, is recognized by one of India’s top EMS providers, Syrma SGS, with an award for innovation that advanced process optimization, enhanced operational efficiency, and yield gains.
Integrated Solutions for Board-level Reliability: A Smarter Path Forward
08/27/2025 | Alan Gardner, MacDermid Alpha Electronics SolutionsIn today’s electronics manufacturing landscape, reliability is no longer just a benchmark but a business imperative. As industries such as automotive, aerospace, and high-performance computing (HPC) push the boundaries of innovation, the demand for dependable board-level performance under extreme conditions has never been greater.
ZESTRON Expands Capabilities with Addition of the EPS by i-Tech AG 75 Pallet Cleaning System
08/26/2025 | ZESTRONZESTRON, the global leader in high-precision cleaning solutions and services, is excited to announce the addition of a new capability in its Technical Center in Manassas, VA: