Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
NXP Collaborates with Foxconn on Next Generation Vehicle Platforms
July 20, 2022 | Globe NewswireEstimated reading time: 1 minute
NXP Semiconductors announced that it has signed a memorandum of understanding with Hon Hai Technology Group (Foxconn) to jointly develop platforms for a new generation of smart connected vehicles. Hon Hai (Foxconn), the world’s largest electronics manufacturer and a leading technology solution provider, will leverage NXP’s portfolio of automotive technologies and its longstanding expertise in safety and security to enable architectural innovation and platforms for electrification, connectivity and safe automated driving. The collaboration builds on the company’s initial digital cockpit partnership, based on the NXP i.MX applications processors and NXP Software Defined Radio platform.
The primary focus of the expanded collaboration is aimed at Foxconn’s efforts in electrical vehicle (EV) platforms, leveraging NXP’s system expertise and comprehensive electrification portfolio, from NXP S32 processors to analog-front-end, drivers, networking and power products. Another innovation priority is connectivity solutions using the latest NXP S32 domain and zonal controller family for gateways and vehicle networking control, while also advancing secure car access with ultra-wideband (UWB) and Bluetooth Low Energy (BLE). A third pillar is safe automated driving augmented by NXP’s leading radar solutions. NXP will also offer hardware and software support and will leverage the expertise of its well-rounded 3rd-party ecosystem in the areas of electrification, connectivity and automation.
“Foxconn sees the disruptive challenges and the potential for innovation in today’s automotive industry. This is a prime opportunity for our particular electronics expertise,” said Young Liu, Chairman of Foxconn. “NXP’s longstanding expertise and leadership in automotive, its innovative products and its laser focus on safety, security and quality provide the foundation for the collaboration we are activating today.”
“We are proud to join forces with Foxconn today to support its ambitious leap into automotive and to jointly address the challenges and opportunities of a new generation of smart connected vehicles, especially Foxconn’s new electric vehicle platform,” said Kurt Sievers, President and CEO of NXP Semiconductors. “The auto industry must become faster and more efficient, and NXP is pleased to extend its technology portfolio to enable electrification, next generation architectures, smart and secure car access systems and more.”
Share on:
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).