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Advanced Electronics Packaging Digest

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KYZEN’s Chelsea Jewell Named to SMTA Next Gen 10 List of Emerging Electronics Industry Leaders

07/14/2026 | KYZEN
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce that Chelsea Jewell, who serves as Manager of the KYZEN Applications Laboratory in Nashville, TN, has been recognized as an emerging leader by SMTA in the organization’s Next Gen 10 program.

HANZA Continues the Horizon Program and Closes Gateway China

07/14/2026 | HANZA
Earlier this year, HANZA launched its HANZA 2028 strategy, aimed at broadening the Group’s manufacturing capabilities through the introduction of new technologies while also expanding capacity and expertise within existing technologies.

Intel Invests €5 Billion to Expand Manufacturing in Europe

07/14/2026 | Intel
Intel announced a €5 billion ($5.7 billion) capital investment at its Leixlip campus in Ireland, marking the next phase in the site’s capacity expansion. 

TTM Technologies Arrives at the 2026 Farnborough International Airshow

07/14/2026 | TTM Technologies
TTM Technologies, Inc., a leading global manufacturer of advanced electronics and interconnect solutions for aerospace, defense, and high-technology markets, announced its exhibition at the upcoming 2026 Farnborough International Airshow — the world's premier aerospace and defense event.

AI Infrastructure Boom Drives Taiwan Suppliers Toward U.S. Manufacturing Expansion

07/14/2026 | Globe Newswire
The AI buildout is usually described in one word: chips. But the more revealing story may be happening downstream in the specialty automation, robotics and semiconductor production equipment needed to build and package those chips at scale. U.S. power companies are already scrambling to secure basic grid equipment for AI data centers, and experts project the global semiconductor industry will reach $975 billion in sales in 2026.
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