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Bittele Enhances PCB Assembly Facility to Accommodate Extended Part Lead Times
July 21, 2022 | Newswire.comEstimated reading time: Less than a minute
Bittele Electronics Inc., a Toronto-based PCB manufacturer specializing in prototype and small-to-mid volume printed circuit board assembly, announced the expansion of its Markham, Ontario, PCB assembly facility. Bittele has expanded its component warehouse to provide more storage space for consigned inventory since extended part lead times still plague the component market.
"Bittele Electronics is proud to announce the expansion of our Markham assembly facility," said Ben Yang, CEO of Bittele Electronics. "With the expanded warehouse, we can store consigned parts for ongoing and upcoming orders. We also offer the option of purchasing and stocking critical items from a customer's BOM upon request."
In addition to the expansion of its component warehouse, Bittele has also installed a new Soltec Wave Soldering Machine, which will be utilized for larger-volume, through-hole assembly. The new wave soldering machine will complement its current Ersa Selective Soldering Machine and will be operational later this summer.
Bittele's Markham facility offers quick-turn prototype to mid-volume production focusing on its North American customers and features fully automated printed circuit board (PCB) loading, solder paste printing, component placement, reflow and inspection.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.