-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
The Practical Side of Using EM Solvers
August 1, 2022 | Heidi Barnes, Keysight TechnologiesEstimated reading time: 2 minutes

Electromagnetic (EM) solvers based on Maxwell’s equations have proven invaluable in the advancement of digital electronics and wireline communications. Plain and simple, electrical engineers need to know what a circuit or electrical interconnect will do when excited by a dynamic or varying signal. In the signal integrity world, an interconnect that passes a DC connectivity check can completely fail at higher frequencies. In the power integrity world, a power rail that measures the correct DC voltage could easily go into oscillation when a dynamic load is applied. Learning the basic skills to fire up an EM simulator, obtain qualitative answers in minutes, and higher fidelity answers in a few days, can be the difference between sleepless nights of product failures vs. robust designs with wide design margins.
In the beginning and even today, EM simulators are constantly in search of the right balance between accuracy and speed to “mesh” a three-dimensional structure and acquire the right answer. In the search for the ultimate solution to Maxwell’s equations, whether it is in the frequency domain for finite element methods (FEM) or in the time domain for finite difference time domain (FDTD), the user interface often suffers. Setting up ports, boundary conditions, and mesh topology might give the guru user additional flexibility. For most of us, we need automation to reduce the repetitive tasks.
Figure 1: 3D EM simulators like PathWave ADS SIPro and PIPro make it easy to select nets and auto assign ports for fast EM setup and simulation. EM current density results on the right for a DDR4 DIMM board show how the power delivery at 10 kHz comes from the J1 edge connector, but at the higher 10 MHz frequency the power is being delivered by the on-board capacitors.
The good news is the processing speed of modern computers and low-cost memory has made it much easier to maintain significant accuracy while increasing speeds. This has enabled increased investment in optimizing user interfaces for specific applications, like simulating multi-layer laminate PCB designs. The improved user interfaces like Keysight’s PathWave ADS SIPro and PIPro rely on robust importing of EDA PCB CAD data, which include stackup, nets, and components for easy selection of nets and components for simulation. Ports can be automatically assigned, and default meshing and boundary conditions enable users to be up and running with an EM simulation in a matter of minutes.
However, simulators are notorious for “garbage in equals garbage out.” Here are a few tricks of the trade to ensure a proper setup.
To read this entire article, which appeared in the July 2022 issue of Design007 Magazine, click here.
Suggested Items
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
Ventec Strengthens Commitment to Halogen-Free PCB Manufacturing in Europe
06/11/2025 | Ventec International GroupVentec International Group, the PCB materials innovator, manufacturer, supplier and one-stop shop for copper clad laminates, prepregs, as well as process consumables and PCB manufacturing equipment has established volume inventory of halogen-free FR4.1 and FR15.1 PCB materials at its European hub in Germany.
Ventec International Group Enters into a Fulfillment and Supply Agreement with Matrix and Launches Ventec Americas
06/09/2025 | Ventec International GroupVentec is excited to announce a new partnership with Matrix aimed at enhancing the fulfillment, value-added conversion, and distribution of PCB base materials across the North American market. This collaboration is set to significantly improve supply chain efficiency, and delivery performance for the company's North American customers.
Panasonic Appoints Matrix as its Authorized Distributor in Europe
06/03/2025 | Matrix ElectronicsEffective July 1st, 2025, Panasonic Industry Co., Ltd. has appointed Matrix Electronics Limited as its Authorized Distributor in the European region.
From DuPont to Qnity: A Bold Move in Electronics Materials
05/14/2025 | Marcy LaRont, I-Connect007DuPont has announced the intended spinoff of a public independent electronics company, Qnity, which will serve as a solutions provider to the semiconductor and electronics industries to enhance competitiveness and innovation in advanced computing, smart technologies, and connectivity. In this interview, Jon Kemp, Qnity CEO-elect and current president of DuPont’s Electronics business, shares his insights on the strategic separation from DuPont.