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I-Connect007 Releases Episode 4 of ‘PCB Materials: The Backbone and Future of Electronics’ Podcast Series

04/09/2026 | I-Connect007
I-Connect007 is excited to announce the release of Episode 4 in its six-part podcast series with Isola experts, PCB Materials: The Backbone and Future of Electronics. Titled “Reliability Under Pressure—PCBs in Harsh Environments,” this episode explores the challenges of maintaining long-term performance in demanding applications like aerospace, automotive, and defense. Host Marcy LaRont speaks with Laura Martin, director of strategic markets at Isola, about what reliability truly means when printed circuit boards are pushed to their limits.

EIPC Winter Conference Review: From Innovation to Qualification

02/13/2026 | Pete Starkey, I-Connect007
Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”

Fresh PCB Concepts: Cost Stability in a Period of Copper and Gold Volatility

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Anyone who works with PCBs in any capacity right now can feel that copper and laminate prices are not stagnant, gold price is increasing even faster, and the impact shows up quickly on PCB quotations. For many design teams, this feels like a force outside their control. Raw materials go up, and the board cost goes with it. I want to highlight that many of these swings are manageable.

Flex Circuit Connectors Standard and Custom Parts Offered

02/04/2026 | PRNewswire
ETCO Incorporated has introduced a line of connectors for attaching wires to laminates and other flexible circuits that must bend, fold, or fit into tight, moving, or weight-sensitive spaces in consumer, medical, aerospace, and military applications.

DuPont to Outline Value Creation Strategy and Financial Framework

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DuPont is hosting its 2025 Investor Day with members of its senior leadership team to introduce the new DuPont portfolio following the intended spin-off of its electronics business, Qnity Electronics, Inc. on November 1, 2025..
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