CEVA Celebrates 15 Billionth CEVA-powered Chip Shipped
August 11, 2022 | PR NewswireEstimated reading time: 1 minute

CEVA, Inc., the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions, announced today that cumulative royalty-bearing chip shipments that include CEVA IP surpassed 15 billion units during the second quarter. This significant milestone has been achieved as CEVA approaches it's 20-year anniversary of being a public company. While the first 10 billion CEVA-powered shipments spanned more than 15 years, the next 5 billion shipments took less than three and a half years.
The incredible rapid adoption rate of CEVA's IP in the IoT era is a testament to the company's role in the democratization of wireless connectivity, through the broad licensing of its 5G, cellular IoT, Bluetooth, Wi-Fi and UWB platform IP to hundreds of semiconductors and OEMs. This effectively lowered the entry barriers for embedding wireless connectivity in SoCs, enabling companies to design more cost-effective and power-efficient chips that led to the proliferation of wirelessly-connected devices that we take for granted today. These devices include smartphones, wearables, hearables, wireless speakers, smart home appliances, white goods, plugs, lights and many more.
Gideon Wertheizer, CEO of CEVA, stated: "Surpassing the 15 billion CEVA-powered chip shipment milestone is a very noteworthy accomplishment for CEVA and its customers. The steep shipment ramp we have experienced over the past 3 years directly coincides with the explosion of IoT devices, where almost every electronic device that ships today is connected. We have been developing and investing in wireless technologies for two decades, and today CEVA is proud to be at the forefront of wireless connectivity in the IoT era. Going forward, as devices become increasingly smarter, integrating more sensors and intelligence, our sensing technologies and edge AI platforms are primed to build on our wireless success. We are excited and invigorated by what's next for CEVA as the adoption of our technologies continues to grow and we reach new heights."
Today, more than 50 CEVA-powered devices are sold every second around the world. For more insight into some of the latest CEVA-powered devices, visit our website at https://www.ceva-dsp.com/powered-products/.
Suggested Items
Intervala Hosts Employee Car and Motorcycle Show, Benefit Nonprofits
08/27/2024 | IntervalaIntervala hosted an employee car and motorcycle show, aptly named the Vala-Cruise and it was a roaring success! Employees had the chance to show off their prized wheels, and it was incredible to see the variety and passion on display.
KIC Honored with IPC Recognition for 25 Years of Membership and Contributions to Electronics Manufacturing Industry
06/24/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is proud to announce that it has been recognized by IPC for 25 years of membership and significant contributions to electronics manufacturing.
Boeing Starliner Spacecraft Completes Successful Crewed Docking with International Space Station
06/07/2024 | BoeingNASA astronauts Barry "Butch" Wilmore and Sunita "Suni" Williams successfully docked Boeing's Starliner spacecraft to the International Space Station (ISS), about 26 hours after launching from Cape Canaveral Space Force Station.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.