Flexible Thinking: Rules of Thumb—A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
Indium’s Jason Chou to Present at SEMICON Taiwan
August 16, 2022 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation senior area technical manager, Jason Chou, will present on low-temperature solders at SEMICON Taiwan’s TechXPOT on Thursday, September 15, in Taipei, Taiwan.
In Lead-Free Low-Temperature Solder Paste for Drop Shock Critical Applications, Chou will focus on Durafuse™ LT, a patented low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C. The innovative material provides improved drop shock resilience, outclassing bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and performing better than SAC305 with optimum process setup. Durafuse™ LT is the only existing solution that ensures reliability with low-temperature requirements and is ideal for customers seeking low-temperature solder paste to address warpage issues, step soldering, and reduced energy consumption.
His Chinese-language presentation is scheduled for 10:10 a.m.–10:40 a.m. local time at booth #I2026, in the Innovative Technology and Product category.
As senior area technical manager in Taiwan, Chou provides technical support to customers with a focus on the semiconductor industry. He has 10 years of industry experience, including specialization in front-end wafer fabrication processes, thin-film modules, and defect analysis for wafer metrology. Chou earned a master’s degree in Chemistry from National Tsing Hua University and a bachelor’s degree in Chemistry from National Cheng Kung University. He served as the group leader for the National Nano Device Laboratory, Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.
Share on:
Suggested Items
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
SolderKing Celebrates a Year of Expansion, Innovation, and Sustainability Achievements
12/09/2024 | SolderKing Assembly Materials Ltd,SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, has wrapped up 2024 with a series of milestones that reflect its ongoing growth and commitment to innovation.