Chiplet Summit Helps Designers Create Huge Chips
August 19, 2022 | Business WireEstimated reading time: Less than a minute
Chiplet Summit debuts at the San Jose Doubletree Hotel on January 24-26, 2023. It focuses on techniques that extend Moore’s Law to ever-smaller dimensions. Chiplets reduce costs, increase modularity and scalability, and avoid wastage and manufacturing defects. Chiplets lead to better chips and faster time-to-market.
The Summit will feature major vendor keynotes, expert tables, and technology and market updates. It will also offer sessions on architectures, development methods, and applications, as well as panels on architectures and platforms, optimization, viable markets, and short-term and long-term trends. Designers will learn to develop high-performance chips at low cost. An exhibit area will showcase the latest products from industry leaders.
“Chiplets help designers control costs and schedules at the latest process nodes. They also allow capture of off-the-shelf designs,” said Chuck Sobey, Chiplet Summit General Chairperson. He noted that, “The event will bring specialists in all aspects of chip development together to ensure successful projects.”
Suggested Items
Real Time with… IPC APEX EXPO 2024: Transitioning Into Automation With DIS
05/08/2024 | Real Time with...IPC APEX EXPOPublisher Barry Matties and DIS Sales Director Jesse Ziomek discuss the company's shift toward automation, tackling issues such as limited floor space and integration costs while showcasing the advantages their SAM automation system has to offer. Also discussed are workforce challenges and return on investment considerations. As Jesse states, "DIS's goal is to offer solutions for smaller shops," and underscores the user-friendly, no-integration-costs aspect of their system.
Electronics Industry Sentiment Rose in April, Hitting New High
05/02/2024 | IPCApril 2024 marked the third consecutive month of sentiment growth among electronics manufacturers. When asked if they expected labor costs for hourly workers to rise over the next month, manufacturers in the United States, Mexico, and Europe predicted a five percent increase, while manufacturers in Asia predicted a slightly lower four percent increase.
Electronics Industry Sentiment Rises in March
03/27/2024 | IPCIPC releases March 2024 Global Sentiment of the Electronics Supply Chain Report
NEC UPF Achieves Industry-Leading High Performance in 5G Core Networks, reaching 1.3Tbps Throughput
02/23/2024 | JCN NewswireNEC Corporation (NEC; TSE: 6701) has confirmed that its User Plane Function (UPF) for processing user data traffic in 5G core networks (5GC) has achieved an industry-leading throughput of 1.3Tbps per server on Intel servers with 4th generation Intel Xeon Scalable processors.
Elementary, Mr. Watson: Know the Tradeoffs With Embedded Designs
02/20/2024 | John Watson -- Column: Elementary, Mr. WatsonOne of my great joys as a grandfather of eight is spending time with them at the park. It doesn't take too long until I'm getting stuck on a slide that is too small for me or on the seesaw, with me on one side and them trying to lift me. At that point, they learn some harsh lessons in physics and how heavy Grandpa really is. A seesaw is a relatively simple device, but it’s a great way to explain a rather complex concept in PCB design: design tradeoffs. Each decision made throughout a design comes with inherent pros and cons.