SEMICON China 2022 to Highlight Sustainability, Smart Manufacturing and Advanced Packaging
August 23, 2022 | SEMIEstimated reading time: 1 minute

With sustainability, smart manufacturing and advanced packaging key to the semiconductor industry’s profitable growth, SEMICON China 2022 will gather industry leaders and visionaries October 5-7 at the Shanghai New International Expo Centre for the latest insights on these and other critical topics for the electronics supply chain. The world’s largest semiconductor conference and exhibition, SEMICON China is a key enabler of collaboration and innovation across the entire electronics ecosystem including chip design, manufacturing, assembly and test, equipment and materials. Registration for this special edition of the event, co-located with FPD China, is open.
SEMICON China 2022 Highlights:
- Grand Opening Keynotes – Industry leaders will present global business and technology developments and market trends. A live broadcast of the proceedings will be accessible on the Grand Opening Keynotes webpage.
- Power & Compound Semiconductor International Forum – The two-day program will highlight topics including wide band gap (WBG) power electronics, optoelectronics, compound semiconductors in communications, and emerging power device technologies.
- Supply Chain Theme: SEMI Innovation and Investment Forum (SIIP China) – The forum will focus on topics including economic environment, industry dynamics, trade issues, STAR Market opportunities, Internet of Things (IoT), international cooperation, equipment and materials procurement, and semiconductor supply chain challenges and opportunities.
- Design Innovation Forum: Electronic System Design Alliance Session – ARM China, CIP United and China Flash will showcase their latest semiconductor design innovations.
- Semiconductor Manufacturing and Advanced Packaging Forum – Global industry leaders and experts will share insights into advanced manufacturing and heterogeneous integration roadmaps (HIR) with a focus on key technologies, equipment and materials, and supply chain development.
- Smart Manufacturing Forum – Major semiconductor manufacturing players such as Amkor Technology, Intel, Lam Research and Huawei and their suppliers will discuss the latest smart manufacturing capabilities and best practices.
- Sustainable Development (Green High-Tech Facility) Forum – With the implementation of effective sustainability practices across the semiconductor supply chain growing in urgency, this forum will address ways the industry can balance its growth with decarbonization goals.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Review: PCEA Orange County Summer Meeting
08/06/2025 | Dan Feinberg, Technology Editor, I-Connect007The Printed Circuit Engineering Association (PCEA) represents a community of engineers, designers, and industry influencers dedicated to the advancement of PCB technology, design, and manufacturing, and the growth and knowledge of its membership. PCEA regularly hosts events to share the latest developments, best practices, and visions for the future of electronic design and manufacturing. The Orange County chapter seems to be one of the largest and most active ones and I was invited to attend the latest chapter event on July 24 in Costa Mesa, California.
Benchmark Announces Appointment of Chuck Swoboda to Board of Directors
08/05/2025 | Benchmark Electronics Inc.Benchmark Electronics, Inc., a global provider of engineering, design, and manufacturing services, announced the appointment of Charles “Chuck” Swoboda to its Board of Directors.
Federal Electronics Marks 10th Year of ISO 13485 Certification with Successful 2025 Surveillance Audit
08/05/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has successfully completed its 2025 ISO 13485:2016 surveillance audit at the company’s Cranston, Rhode Island facility.
Report: Green Electronics Market to Hit $46.53B by 2029
08/05/2025 | Globe NewswireAccording to the Green Electronics Manufacturing Market Report 2025, this sector will grow from $16.81 billion in 2024 to $20.66 billion in 2025 at a compound annual growth rate (CAGR) of 22.9%.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.