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HDP User Group Announces Advanced Micro Devices Membership
August 29, 2022 | HDP User GroupEstimated reading time: Less than a minute
High Density Packaging (HDP) User Group is pleased to announce that Advanced Micro Devices, Inc (AMD)has become a member.
“AMD thrives on an innovation-driven culture; my team evaluates PCB(A) related processes & components required to bring next generation products to market. We look forward to collaborating with HDP member OEMs, CMs, test service providers, and component/material suppliers to leverage our combined expertise in solving complex industry PCB(A) technology challenges”, said Jim Merkelbach, Senior Manager – Global PCBCAD, Data Center Engineering at AMD.
“I am pleased to welcome AMD to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in high performance semiconductors, especially those focused on next-generation servers and cloud computing, will contribute significantly to several of our emerging technology projects”, said Larry Marcanti, Executive Director of HDP User Group.
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