Flexible Thinking: Designing Flex Circuits for Dynamic Reliability
Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Avalanche Technology, UMC Announce 22nm Production of High-Density MRAM-Based Devices
September 12, 2022 | Business WireEstimated reading time: 1 minute
Avalanche Technology, the leader in next-generation MRAM technology, and United Microelectronics Corporation (UMC), a leading semiconductor foundry, announced the immediate availability of new High-Reliability Persistent SRAM (P-SRAM) memory devices through UMC’s 22nm process technology. Based on Avalanche Technology’s latest generation of Spin Transfer Torque Magnetoresistive RAM (STT-MRAM) technology, this much anticipated third-generation product platform offers significant density, endurance, reliability and power benefits over existing non-volatile solutions.
“With this new product release, Avalanche Technology is bringing to market standard products that are truly enabling a variety of applications that require high endurance, reliability and density, but without the need for external batteries, ECC or wear leveling,” said Danny Sabour, Vice President of Marketing and Business Development at Avalanche Technology. “The increased ubiquity of sensors constantly recording data and high transaction applications require highly endurant memory that doesn’t wear out. We will also soon be launching development efforts to raise the bar even further toward 16Gb monolithic solutions.”
“We are pleased to work with a technology leader like Avalanche Technology to bring this stand-alone memory solution into production. This is an important project to help commercialize robust and highly scalable MRAM solutions for the industry,” said G C Hung, Vice President of the Result Delivery Office and Research Development at UMC. “With our comprehensive foundry technology portfolio and focus on manufacturing excellence, UMC is well positioned to serve the growing demand for persistent memory through Avalanche Technology’s powerful solutions.”
“Avalanche Technology has intensively developed our innovative perpendicular Magnetic Tunnel Junctions (pMTJ) based STT MRAM technology since 2006. Our industry leading pMTJ and CMOS designs are enabling the most advanced high-density and high-performance STT MRAM products, which are now available through our foundry partner UMC,” said Yiming Huai, Chief Technology Officer and Vice President of Technology & Foundry Business at Avalanche Technology.
Avalanche Gen 3 Persistent SRAM
The Parallel x 32 series is offered as a standard product in various density options and has asynchronous SRAM-compatible read/write timings. Data is always non-volatile with our industry leading >1014 write cycle endurance and 1,000-year retention (at 85°C). Both density options are available in a small footprint 142-ball FBGA (15mm x 17mm) package. The devices are offered in the extended (-40°C to 125°C) operating temperature range with a JEDEC qualification flow, where every device goes through a 48-hour burn in before being shipped to customers. There are additional qualification screenin
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Everspin Executes $40M Agreement for Mil-Aero MRAM Applications
04/30/2026 | Everspin Technologies, Inc.Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.
Swinburne University, Siemens Launch Australia’s First Quantum Timing Study for Smarter Power Grids
04/30/2026 | SiemensSwinburne University of Technology and Siemens are undertaking first-of-its-kind research in Australia, into how quantum-enhanced timing can help future-proof the energy grid and increase grid stability.
A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.
OKI Develops 180-Layer, 15 mm PCB for AI Semiconductor Test Equipment
04/29/2026 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) mounted on AI semiconductors.
ASC’s John Johnson Bullish on the U.S. and High-tech PCBs
04/28/2026 | Marcy LaRont, I-Connect007It was a good couple of days at the SMTA UHDI Symposium in Avondale, Arizona, in early April, where John Johnson, head of technology at American Standard Circuits (ASC) and resident PCB expert on UHDI in the real-world of manufacturing, was a presenter. As the symposium ended, I visited with John, who reflected on what he considered most important and what had made the greatest impression on him.