Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

Koh Young Highlighting its Smart AI Solutions at the SMTA Monterrey Expo and Tech Forum

04/15/2026 | Koh Young
Koh Young, the industry leader in True 3D measurement-based inspection solutions, will exhibit at the upcoming SMTA Monterrey Expo & Tech Forum on Thursday, April 23, 2026, at Cintermex, located at Av. Fundidora 501, Colonia Obrera, Monterrey, Nuevo León, Mexico.

Meet Emerging Engineer Logan Bistodeau, IBM

04/09/2026 | Michelle Te, I-Connect007
When he was growing up, Logan Bistodeau was always interested in how heavy machinery worked, so it was natural that he earned a mechanical engineering degree at Iowa State University. He originally grew up near the Twin Cities in Minnesota, now works for IBM, and is in his first year of the Emerging Engineer Program through the Global Electronics Association. I got to know Logan a little better at APEX EXPO 2026.

Target Condition: An Exploration of Flooding PCB Layers

04/02/2026 | Kelly Dack -- Column: Target Condition
The concept of flooding PCB layers with copper has been around for so long, you’d think we’d have it mastered. We haven’t. (Oh, and by “we,” I mean design engineers and the software tools we depend on.) Years ago, PCB artwork was created by hand using light tables, with tape applied to Mylar. Signals were slow, traces were relatively wide, and high-current paths were simply “beefed up” with wider copper. Signal integrity wasn’t yet a driving concern. Today, solid return paths are fundamental to robust design. We understand the importance of continuous reference planes for signal integrity and EMI control.

RFMW, Powerex Sign Distribution Deal for High-Power Mission-Critical Semiconductors

03/24/2026 | BUSINESS WIRE
This partnership expands RFMW’s portfolio with Powerex’s extensive range of rectifiers, thyristors, IGBTs, SiC modules, and custom power assemblies designed for demanding high-power applications.

Dongguk University Develops Breakthrough Material for Next-Gen Smart Devices

03/13/2026 | PRNewswire
Next-generation optoelectronic systems (devices that convert light to electrical energy) leverage organic semiconductor-based indoor energy-autonomous architectures for cutting-edge applications.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in