Geely Holding Group Expands Mobileye Collaboration
September 26, 2022 | IntelEstimated reading time: 1 minute
Mobileye and Geely Holding Group announced the expansion of their ongoing collaboration for advanced driver-assistance systems (ADAS) and autonomous vehicle technology. The announcement follows the successful launch of the ZEEKR 001 premium electric vehicle (EV) with Mobileye SuperVision™ technology, with more than 40,000 vehicles already on the road and ahead of an over-the-air (OTA) update that will unlock SuperVision’s full capabilities.
Building on the success with the premium electric mobility technology brand ZEEKR, three additional brands under the Geely Holding Group umbrella are set to globally launch electric vehicle models with Mobileye SuperVision technology beginning next year. ZEEKR will also introduce Mobileye SuperVision on two new EV models, as well as developing new lidar-based features with Mobileye.
“We have proudly worked with ZEEKR, our strategic partner, on the first consumer deployment of SuperVision technology, demonstrating both its on-road capabilities and its ability to evolve through over-the-air updates,” said Prof. Amnon Shashua, Mobileye president and chief executive officer. “This is only the beginning of potential applications for this technology, and with these new projects, we will demonstrate how SuperVision can be adapted to any brand’s specific needs.”
An Conghui, president of Geely Holding Group and CEO of ZEEKR Intelligent Technology, said: "Mobileye is an important strategic partner for ZEEKR. As the cooperation between ZEEKR and Mobileye continues to deepen, Mobileye's globally leading intelligent driving technologies will be used in more ZEEKR models in the future. ZEEKR is committed to openness and integrating future technologies in various fields to provide our users with better intelligent drive experiences."
ZEEKR 001 customers already benefit from constantly upgrading surround vision-based, highway-assist capabilities with special safety features. The system is expected to receive full SuperVision capabilities through over-the-air updates by the end of this year that will bring ZEEKR customers‘ driving experience to the next level.
Mobileye SuperVision is powered by two 7 nanometer EyeQ®5 system-on-chip. It supports point-to-point assisted driving under a wide range of road types – from highway, arterial and rural to urban. Mobileye SuperVision enables the vehicle to change lanes autonomously, navigate intersections and manage key driving priorities, as well as powering automated parking and preventive steering and braking. The Mobileye SuperVision system uses 11 high-resolution cameras – seven long-range and four parking cameras – to provide full visual coverage surrounding the vehicle.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Everspin Executes $40M Agreement for Mil-Aero MRAM Applications
04/30/2026 | Everspin Technologies, Inc.Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.
Swinburne University, Siemens Launch Australia’s First Quantum Timing Study for Smarter Power Grids
04/30/2026 | SiemensSwinburne University of Technology and Siemens are undertaking first-of-its-kind research in Australia, into how quantum-enhanced timing can help future-proof the energy grid and increase grid stability.
A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.
OKI Develops 180-Layer, 15 mm PCB for AI Semiconductor Test Equipment
04/29/2026 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) mounted on AI semiconductors.
ASC’s John Johnson Bullish on the U.S. and High-tech PCBs
04/28/2026 | Marcy LaRont, I-Connect007It was a good couple of days at the SMTA UHDI Symposium in Avondale, Arizona, in early April, where John Johnson, head of technology at American Standard Circuits (ASC) and resident PCB expert on UHDI in the real-world of manufacturing, was a presenter. As the symposium ended, I visited with John, who reflected on what he considered most important and what had made the greatest impression on him.