-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
ILFA Invests in the Expansion of its PCB Lamination Capacities
September 27, 2022 | ILFAEstimated reading time: 1 minute

During the LAUFFER Technology Days, ILFA Managing Director Thomas Michels and LAUFFER Managing Director Christof Lauffer announce a close cooperation, which is sealed with a joint letter of intent. The new investment project, which is part of ILFA's modernisation offensive, is aimed at a highly automated lamination centre that will sustainably support PCB production at ILFA's Hanover site.
With the planned new investment from LAUFFER, ILFA GmbH will triple its production capacity in the lamination area. At a cost of more than EUR 1.3 million, the laminating centre would be the largest single investment to date in the company's 43-year history. The modernisation offensive at ILFA provides for total investments in the higher double-digit million range. In addition to increased automation, numerous new acquisitions are currently being made in the areas of OFT (surface technology) and FLT (photo and lacquer technology). These include a new DES line, solder resist developers, micro etching and a new plasma system.
Thomas Michels explains: "On the one hand, we want to grow technologically, but on the other hand, we also want to significantly expand our production capacities. In this way, we will consolidate our position in the market and further establish ourselves in the field of rigid-flex printed circuit boards, RF and power technology as well as in the process-safe processing of the finest structures. We are pleased to have gained LAUFFER as a partner who will support us with its many years of expertise."
The projected RMV 125/6 LAUFFER lamination centre is characterised above all by a high degree of automation and very high energy efficiency during the lamination process. Thanks to the unique design concept with large storage capacities, which was specially adapted to ILFA's requirements, the laminating system can be operated fully automatically even during night shifts or so-called ghost shifts. Another innovation is the operation of the system with newly designed heat accumulators for heat recovery during press operation. These enable energy saving effects of up to 30% depending on the operating mode of the entire system. "We are pleased to be able to realise this project together with ILFA. We see this as an important signal for the European PCB industry and especially for the domestic market in Germany," says Christof Lauffer about the jointly planned project.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.