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VJ Electronix Takes Automated Rework to the Next Level at SMTAI with New Auto Align Feature
October 3, 2022 | VJ Electronix, Inc.Estimated reading time: Less than a minute
VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, is pleased to announce plans to exhibit at SMTA International, scheduled to take place Nov 2-3, 2022 at the Minneapolis Convention Center in Minnesota. The company will demonstrate the Summit 2200i rework system with new Auto Align and XQuik III X-ray component counter in Booth #836.
The Summit 2200i is a high precision, fully automatic system for medium-sized SMD assemblies. The Summit 2200i is capable of handling boards up to 22"x30” and components as small as 01005, and requires minimal operator intervention. The new automatic alignment through AI technology allows for alignment of components with no operator intervention required. The software automatically detects the corners of the component and site using fiducials, and the pick locations (centerpoint) are determined automatically.
The latest in the XQuik line, the XQuik III meets the demands of today’s complex inventory requirements with advanced AI component recognition, extremely fast cycle times (< 10 sec. – including barcode scan), industry-leading count accuracy of 99.8% or greater across the widest range of components, real-time MES/ERP updates, simple user interface (UI) and competitively low pricing.
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Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.