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Victory Giant Technology to Showcase Carbon Footprint Calculator at PCB West 2022
October 3, 2022 | Victory Giant TechnologyEstimated reading time: 1 minute
Victory Giant Technology, the fastest growing publicly traded PCB fabricator in China today announced they will showcase a new software tool for calculating total carbon emissions for any PCB design.
VGT’s Executive VP & CTO George Dudnikov commented, “VGT has been addressing the reduction of Green House Gases (GHG) and improved Sustainability of the PCB process since 2011. Through the continued focus on process automation and electricity/water conservation efforts, the company has saved 106,624,100 Kwh of electricity and reduced carbon emissions by 37,507 tons of CO2 through Jan 2021. Our data collection and process monitoring methods have been certified to GB/T 23331-2020, ISO 50001-2018, and RB/T-101-2013 standards.” The company has been recognized by the Chinese Government as a leading “ Green Manufacturer”.
We were asked by several large OEM customers if we could develop a method to quantify the environmental impact of specific PCB part numbers so that they could use the information to optimize and reduce the carbon emissions of their PCBs in support of their corporate Sustainability Initiatives. We had the data for key PCB processes but needed a way to add material ( laminate, copper foil, and prepreg ) contributions and effects of special processes like sequential lamination, VIPPO, HDI, etc. Tools available on the market were too generic and could not support the process complexity of an advanced PCB design. As we had experience with several PCB stackup tools, we saw a natural opportunity for a joint development project to develop a CFP Calculator.”
Visitors to the Victory Giant Technology Booth 303 will be able to obtain the following information:
- Meet with representatives from VGT to review Sustainability accomplishments and get a demo of the CFP Calculator tool.
- Arrange for a free Carbon Footprint analysis of any design based on Gerber data.
- Review VGT’s other capabilities for advanced HDI and High-Speed PCBs
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Simon Khesin - Schmoll MaschinenSuggested Items
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
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Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.