Dan’s Biz Bookshelf: ‘Costovation: Innovation That Gives Your Customers Exactly What They Want—And Nothing More’
The Right Approach: ‘Twas the Night Before Christmas (Harley-style)
It’s Only Common Sense: Dear Santa, Here’s My Sales Wish List
Victory Giant Technology to Showcase Carbon Footprint Calculator at PCB West 2022
October 3, 2022 | Victory Giant TechnologyEstimated reading time: 1 minute
Victory Giant Technology, the fastest growing publicly traded PCB fabricator in China today announced they will showcase a new software tool for calculating total carbon emissions for any PCB design.
VGT’s Executive VP & CTO George Dudnikov commented, “VGT has been addressing the reduction of Green House Gases (GHG) and improved Sustainability of the PCB process since 2011. Through the continued focus on process automation and electricity/water conservation efforts, the company has saved 106,624,100 Kwh of electricity and reduced carbon emissions by 37,507 tons of CO2 through Jan 2021. Our data collection and process monitoring methods have been certified to GB/T 23331-2020, ISO 50001-2018, and RB/T-101-2013 standards.” The company has been recognized by the Chinese Government as a leading “ Green Manufacturer”.
We were asked by several large OEM customers if we could develop a method to quantify the environmental impact of specific PCB part numbers so that they could use the information to optimize and reduce the carbon emissions of their PCBs in support of their corporate Sustainability Initiatives. We had the data for key PCB processes but needed a way to add material ( laminate, copper foil, and prepreg ) contributions and effects of special processes like sequential lamination, VIPPO, HDI, etc. Tools available on the market were too generic and could not support the process complexity of an advanced PCB design. As we had experience with several PCB stackup tools, we saw a natural opportunity for a joint development project to develop a CFP Calculator.”
Visitors to the Victory Giant Technology Booth 303 will be able to obtain the following information:
- Meet with representatives from VGT to review Sustainability accomplishments and get a demo of the CFP Calculator tool.
- Arrange for a free Carbon Footprint analysis of any design based on Gerber data.
- Review VGT’s other capabilities for advanced HDI and High-Speed PCBs
Share on:
Suggested Items
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
Sayonara to the Last Standing Copper Foil Plant in North America
12/17/2024 | Marcy LaRont, I-Connect007In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.
SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition
12/16/2024 | SCHMID GroupThe SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition.
OKI Develops PCB Technology with Stepped Copper Coin Insertion to Achieve 55 Times Better Heat Dissipation in Outer Space
12/12/2024 | BUSINESS WIREThe OKI Group printed circuit board (PCB) business company OKI Circuit Technology has successfully developed multilayer PCB technology with stepped copper coin insertion to achieve 55 times better heat dissipation compared to conventional PCB. The stepped copper coin is offered in two types, circular and rectangular, to suit the shape of the electronic component mounted on the PCB. OTC is working to develop mass-production technologies with the aim of introducing PCBs incorporating this new technology into markets for compact devices or devices used in outer space or other environments where air cooling technology cannot be used.
Fresh PCB Concepts: PCB Plating Process Overview
12/12/2024 | Team NCAB -- Column: Fresh PCB ConceptsIn this installment of Fresh PCB Concepts, Mike Marshall takes the helm stating: PCBs have been the platform for the interconnection of electronic components for decades. Because of process costs and other constraints, such as mechanical properties or size limitations of the alternatives, PCBs will remain the standard low-cost interconnection technology. Rapidly increasing performance and functionality requirements of wireless and high-speed devices have challenged the development and implementation of new manufacturing solutions.