MKS’ Atotech to Participate at ISES Taiwan 2022
October 11, 2022 | AtotechEstimated reading time: 1 minute

Atotech, a brand within the Materials Solutions Division of MKS Instruments, developing leading process and manufacturing technologies for next-generation power semiconductors and advanced packaging, joins the International Semiconductor Executive Summit (ISES Taiwan) in Hsinchu, Taiwan from October 11-12.
On Wednesday, October 12 from 9:30 a.m. – 9:45 a.m. CST, Dr. Christian Ohde, Global Director Semiconductor and Functional Electronics for MKS’ Atotech brand, will give the keynote and present on how technology pushes limits. His topic this year is “Plating solutions for next-generation power semiconductors and advanced packaging of highest reliability”.
During his talk, Dr. Ohde will elaborate on how the increasing functionality resulting from advanced node and packaging technologies as well as reliability requirements of power semiconductors go hand in hand with new requirements for the metallization processes. Furthermore, Dr. Ohde will explain the importance of fundamental R&D, which is the foundation to be equipped to provide next-generation chemistry and equipment solutions and meet the upcoming requirements of the semiconductor industry. He will discuss specific interconnect challenges, including higher stress sensitivity of smaller structures, the integration of heterogeneous structures, and new interconnect technologies to comply with higher interconnect density. He will also explain the path chosen for Atotech solutions when it comes to reliable copper, tailorable pillars, and low-temperature copper-to-copper direct bonding for smallest bonding solutions.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Nolan’s Notes: Tariffs, Technologies, and Optimization
10/01/2025 | Nolan Johnson -- Column: Nolan's NotesLast month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.
MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
09/30/2025 | MacDermid Alpha & Graphic PLCMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Graphic PLC, a Somacis company, with the installation of the first horizontal electroless copper metallization process in the UK.
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30