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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Ucamco Releases UcamX v2022.09 and Integr8tor v2022.09
October 17, 2022 | UcamcoEstimated reading time: Less than a minute
Ucamco is proud to release UcamX v2022.09 and Integr8tor v2022.09. These new versions of our CAM and Pre-CAM software include dozens of additions, new options, fixes and general improvements to increase our customers’s productivity.
UcamX v2022.09 is full of improvements, additions, options and more to keep your CAM department snuggly and cozy over the coming months:
- YELO Mask Adjuster extensions
- Electrical test optimization
- New default ucam.db settings
- Additional Ucam.properties settings
- Optimized Excellon 2 input
- Improved GAR input
Integr8tor v2022.09 holds a host of fixes and code improvements, amongst which:
- NEC layer naming convention added to layer stackup recognition engine
- Drill header recognition engine extensions
- Improved from-to drill span recognition algorithms
UcamX and Integr8tor v2022.09 are now available for download for all maintenance contract users. Customers who wish to upgrade to this version outside of a maintenance contract or wish to take out a maintenance contract, are welcome to contact their local sales channel.
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Sweeney Ng - CEE PCBSuggested Items
OKI Develops 180-Layer, 15 mm PCB for AI Semiconductor Test Equipment
04/29/2026 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) mounted on AI semiconductors.
Target Condition: An Exploration of Flooding PCB Layers
04/02/2026 | Kelly Dack -- Column: Target ConditionThe concept of flooding PCB layers with copper has been around for so long, you’d think we’d have it mastered. We haven’t. (Oh, and by “we,” I mean design engineers and the software tools we depend on.) Years ago, PCB artwork was created by hand using light tables, with tape applied to Mylar. Signals were slow, traces were relatively wide, and high-current paths were simply “beefed up” with wider copper. Signal integrity wasn’t yet a driving concern. Today, solid return paths are fundamental to robust design. We understand the importance of continuous reference planes for signal integrity and EMI control.
Happy’s Tech Talk #47: Automation for Complex Multilayer Fabrication Stackups
03/31/2026 | Happy Holden -- Column: Happy’s Tech TalkMultilayer stackups have evolved dramatically as they’ve been adopted for high-performance computing (HPC) and artificial intelligence (AI) server applications. These high-speed, high I/O designs require the designer and fabricator to manage more boundary conditions than ever before. In practice, the stackup is no longer “just a stackup.” It becomes the foundation for signal integrity, reliability, manufacturability, and cost.
SCHMID Group Wins Major Order for Wet-Process Equipment for AI & HPC Infrastructure
03/11/2026 | SCHMID GroupSCHMID Group, a leading global supplier of advanced wet process equipment for the electronics manufacturing industry, has secured a lower two-digit million-USD purchase order from a major Asian high-end PCB manufacturer for a new HDI multilayer production line.
Standard of Excellence: Building the Board of the Future—Materials, Methods, and Mindset
02/18/2026 | Anaya Vardya -- Column: Standard of ExcellenceThe future of PCB manufacturing is here. The products we’re being asked to build today would have been called “advanced” just a few years ago. What was once special is now standard, and what was once impossible is now expected. The challenge and the opportunity lie in leading the charge to the next frontier of printed circuit board design, materials, and manufacturing discipline. To build the board of the future, we need new materials, smarter methods, and a mindset of innovation anchored in flawless execution.