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Ucamco Releases UcamX v2022.09 and Integr8tor v2022.09
October 17, 2022 | UcamcoEstimated reading time: Less than a minute

Ucamco is proud to release UcamX v2022.09 and Integr8tor v2022.09. These new versions of our CAM and Pre-CAM software include dozens of additions, new options, fixes and general improvements to increase our customers’s productivity.
UcamX v2022.09 is full of improvements, additions, options and more to keep your CAM department snuggly and cozy over the coming months:
- YELO Mask Adjuster extensions
- Electrical test optimization
- New default ucam.db settings
- Additional Ucam.properties settings
- Optimized Excellon 2 input
- Improved GAR input
Integr8tor v2022.09 holds a host of fixes and code improvements, amongst which:
- NEC layer naming convention added to layer stackup recognition engine
- Drill header recognition engine extensions
- Improved from-to drill span recognition algorithms
UcamX and Integr8tor v2022.09 are now available for download for all maintenance contract users. Customers who wish to upgrade to this version outside of a maintenance contract or wish to take out a maintenance contract, are welcome to contact their local sales channel.
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Sweeney Ng - CEE PCBSuggested Items
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EDADOC Ushers in a New Era of Robotics Innovation
10/07/2025 | Edy Yu, Editor-in-Chief, ECIOOn Sept. 11, Shanghai Zhiyuan Technology Co., Ltd. (MScape) made a stunning debut at Shanghai’s 2025 Fourth North Bund Cybersecurity Forum and Cyber Intelligence Security Frontier Technology and Equipment Exhibition. The company presented the world’s first Dvorak super heterogeneous architecture and the Zhijing T-series-embodied intelligence (robotics) edge computing power platform. This has been a game-changer in the cybersecurity technology field, filling the gap in the domestic robotics core computing power platform.
Connect the Dots: Evolution of PCB Manufacturing—Lamination
10/02/2025 | Matt Stevenson -- Column: Connect the DotsWhen I wrote The Printed Circuit Designer's Guide to...™ Designing for Reality, it was not a one-and-done effort. Technology is advancing rapidly. Designing for the reality of PCB manufacturing will continue to evolve. That’s why I encourage designers to stay on top of the tools and processes used during production, to ensure their designs capitalize on the capabilities of their manufacturing partner.
Driving Innovation: Mastering Panel Warpage
09/23/2025 | Simon Khesin -- Column: Driving InnovationDuring the complex and multi-step process of PCB fabrication, a panel's flatness is constantly at risk. A host of factors can introduce warpage, bending, and unevenness, presenting a fundamental challenge to achieving high-precision results. This deformation (sometimes referred to as “bow and twist”), even on a microscopic scale, can lead to critical defects during subsequent stages, such as component surface mounting (e.g., tombstoning, solder opens) and the PCB's long-term functional reliability.
Beyond Design: Slaying Signal Integrity Villains
09/17/2025 | Barry Olney -- Column: Beyond DesignHigh-speed PCB design is a balancing act, where subtle oversights can develop into major signal integrity nightmares. Some culprits lie dormant during early validation, only to reveal themselves later through workflow disruptions and elusive performance bottlenecks. Take crosstalk, for example. What begins as a stray signal coupling between traces can ripple through the design, ultimately destabilizing the power distribution network. Each of these troublemakers operates with signature tactics, but they also have well-known vulnerabilities.