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Ucamco Releases UcamX v2022.09 and Integr8tor v2022.09
October 17, 2022 | UcamcoEstimated reading time: Less than a minute

Ucamco is proud to release UcamX v2022.09 and Integr8tor v2022.09. These new versions of our CAM and Pre-CAM software include dozens of additions, new options, fixes and general improvements to increase our customers’s productivity.
UcamX v2022.09 is full of improvements, additions, options and more to keep your CAM department snuggly and cozy over the coming months:
- YELO Mask Adjuster extensions
- Electrical test optimization
- New default ucam.db settings
- Additional Ucam.properties settings
- Optimized Excellon 2 input
- Improved GAR input
Integr8tor v2022.09 holds a host of fixes and code improvements, amongst which:
- NEC layer naming convention added to layer stackup recognition engine
- Drill header recognition engine extensions
- Improved from-to drill span recognition algorithms
UcamX and Integr8tor v2022.09 are now available for download for all maintenance contract users. Customers who wish to upgrade to this version outside of a maintenance contract or wish to take out a maintenance contract, are welcome to contact their local sales channel.
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04/10/2025 | FraunhoferThe Fraunhofer Institute for Photonic Microsystems IPMS has achieved another milestone in chemical liquid analysis. The electronics required to control the ion-sensitive field effect transistors (ISFET) have been successfully miniaturized.
Just Because You Can, Doesn’t Mean You Should
03/20/2025 | Tony Plemel, Flexible Circuit TechnologiesDecisions are usually made by gathering information and differing opinions, then making the best choice based upon that information. The same process is used when designing flexible circuits and rigid-flex circuits. For example, when designing a flex circuit or rigid-flex circuit, we consider some basic factors.
Beyond Design: Key SI Considerations for High-speed PCB Design
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Managing Energy Flow with Proper Stackup Design
02/13/2025 | Andy Shaughnessy, Design007At Design Con 2025, I had the opportunity to speak with Dan Beeker, technical director at NXP Semiconductor, about his technical session, which focused on optimizing PCB layers to best direct signal and power supply energy between these layers. In this interview, Dan discusses the complexities of board stackup and the significance of understanding dielectric layers for effective signal transmission. Dan is something of a “fields evangelist,” spreading the word about the need for designers to focus on fields, not just circuit theory. Toward the end, Dan summed up much of the design segment: Designing something that didn't make it break is not the same thing as designing it correctly.
Multilayer PCB Market to Reach $116.1B by 2032 at 5.5% CAGR: Allied Market Research
02/12/2025 | Globe NewswireAccording to the report, the "multilayer printed circuit board market" was valued at $71 billion in 2023, and is estimated to reach $116.1 billion by 2032, growing at a CAGR of 5.5% from 2024 to 2032.