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Suggested Items

Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage

08/14/2025 | Markus Voeltz -- Column: Global PCB Connections
Designers don’t need to become fabricators, but understanding the basics of PCB fabrication can save you time, money, and frustration. The more you understand what’s happening on the shop floor, the better you’ll be able to prevent downstream issues. As you move into more advanced designs like HDI, flex circuits, stacked vias, and embedded components, this foundational knowledge becomes even more critical. Remember: the fabricator is your partner.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/08/2025 | Andy Shaughnessy, I-Connect007
If you’ve been watching the news lately, you might be tempted to opine, “What’s going on here?” In this week’s must-reads, we have a wrap-up of the latest news about U.S. tariffs with Asia, and columnist Tom Yang explains why some PCB fabrication business should remain in China. We also have a piece that examines the unprecedented growth that green manufacturing is expected to see over the next four years.

Driving Innovation: Inner Layer Alignment Methods in PCB Production

08/06/2025 | Kurt Palmer -- Column: Driving Innovation
In PCB manufacturing, precision is a fundamental requirement. Among many complex processes, the accurate registration of inner layers before lamination is one of the most critical. Much like a child's game where rings must be perfectly stacked onto a single pin, PCB manufacturers align multiple conductive and insulating layers to form a cohesive, functional board. This alignment directly affects PCB precision; tighter layer alignment results in smaller "annular rings," superior performance, and higher yields.

NCAB Breaks Down Updated Tariff Rate Change

08/04/2025 | NCAB Group
These are the new tariff rates that will go into effect Aug. 7, 2025 at 12:01am EST. Any shipments entering U.S. customs after this time will be affected.

Connect the Dots: Sequential Lamination in HDI PCB Manufacturing

07/31/2025 | Matt Stevenson -- Column: Connect the Dots
As HDI technology becomes mainstream in high-speed and miniaturized electronics, understanding the PCB manufacturing process can help PCB design engineers create successful, cost-effective designs using advanced technologies. Designs that incorporate blind and buried vias, boards with space constraints, sensitive signal integrity requirements, or internal heat dissipation concerns are often candidates for HDI technology and usually require sequential lamination to satisfy the requirements.
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