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Beyond Design: Slaying Signal Integrity Villains

09/17/2025 | Barry Olney -- Column: Beyond Design
High-speed PCB design is a balancing act, where subtle oversights can develop into major signal integrity nightmares. Some culprits lie dormant during early validation, only to reveal themselves later through workflow disruptions and elusive performance bottlenecks. Take crosstalk, for example. What begins as a stray signal coupling between traces can ripple through the design, ultimately destabilizing the power distribution network. Each of these troublemakers operates with signature tactics, but they also have well-known vulnerabilities.

Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs

09/08/2025 | Kurt Palmer -- Column: Driving Innovation
In PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.

Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage

08/14/2025 | Markus Voeltz -- Column: Global PCB Connections
Designers don’t need to become fabricators, but understanding the basics of PCB fabrication can save you time, money, and frustration. The more you understand what’s happening on the shop floor, the better you’ll be able to prevent downstream issues. As you move into more advanced designs like HDI, flex circuits, stacked vias, and embedded components, this foundational knowledge becomes even more critical. Remember: the fabricator is your partner.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/08/2025 | Andy Shaughnessy, I-Connect007
If you’ve been watching the news lately, you might be tempted to opine, “What’s going on here?” In this week’s must-reads, we have a wrap-up of the latest news about U.S. tariffs with Asia, and columnist Tom Yang explains why some PCB fabrication business should remain in China. We also have a piece that examines the unprecedented growth that green manufacturing is expected to see over the next four years.

Driving Innovation: Inner Layer Alignment Methods in PCB Production

08/06/2025 | Kurt Palmer -- Column: Driving Innovation
In PCB manufacturing, precision is a fundamental requirement. Among many complex processes, the accurate registration of inner layers before lamination is one of the most critical. Much like a child's game where rings must be perfectly stacked onto a single pin, PCB manufacturers align multiple conductive and insulating layers to form a cohesive, functional board. This alignment directly affects PCB precision; tighter layer alignment results in smaller "annular rings," superior performance, and higher yields.
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