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Connect the Dots: Proactive Controlled Impedance

05/29/2025 | Matt Stevenson -- Column: Connect the Dots
From data centers to smartphones, designers know that the ohms have it. Getting impedance right ensures all-important signal integrity and delivers high-performing boards. Our designers understand the importance of controlled impedance, but not everyone addresses it in their designs. The most common and important controlled impedance types we see include microstrip, stripline, embedded microstrip, and differential pairs.

Driving Innovation: Traceability in PCB Production

05/29/2025 | Kurt Palmer -- Column: Driving Innovation
Traceability across the entire printed circuit board production process is an increasingly important topic among established manufacturers and companies considering new PCB facilities. The reasons are apparent: Automatic loading of part programs, connection with MES systems and collection of production data, and compliance with Industry 4.0 requirements

OKI Launches 124-Layer Circuit Board Technology

05/22/2025 | Andy Shaughnessy, Design007 Magazine
During PCB East, OKI Circuit Technology unveiled its latest innovation: a 124-layer printed circuit board. In this interview, “Dennie” Kazuo Kawahara, president of OKI Data Americas, and Eiichi Aki, sales and marketing specialist at OKI Circuit Technology, shared their insights into this feat. With plans for mass production starting in October, this board is designed for high-bandwidth memory applications, accommodating the demanding requirements of AI chips.

Global SiC Substrate Revenue Declines 9% in 2024; Long-Term Demand Remains Strong as 8-Inch Roadmap Gains Momentum

05/12/2025 | TrendForce
TrendForce’s latest research shows that weakening demand in the automotive and industrial sectors has slowed shipment growth for SiC substrates in 2024.

SAIC Awarded New $55 Million Mission Integration Contract From Space Development Agency

05/05/2025 | SAIC
Science Applications International Corp. has been awarded the Proliferated Warfighter Space Architecture (PWSA) Tranche 3 Program Integration (T3PI) contract from the Space Development Agency (SDA).
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