Flexible Thinking Flexible Circuit Technology—Looking Back and Forward
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
Isola Reaches Higher in Frequency at 2022 TPCA Show in Taipei
October 21, 2022 | IsolaEstimated reading time: 2 minutes
Isola Asia Pacific will be well represented by its circuit material experts at the 2022 Taiwan PCB & Assembly (TPCA) Show, as they advise attendees on the optimum uses of their materials for the growing numbers of high-frequency analog and high-speed-digital (HSD) electronic circuit applications. The event, with its engineering conference and traditionally lively exhibition hall, is a popular meeting place for professional users of printed-circuit board (PCB) materials. The show, which began in 2000, is scheduled for October 26-28, 2022, in the TWTC Nangang Exhibition Hall (Taipei, Taiwan). Isola’s design and application advisors, from the Isola Asia Pacific division (Taoyuan, Taiwan), will be available all three days of the exhibition at Booth N-411. The knowledgeable Isola TPCA booth team can help attendees with the fine points of specifying a circuit material along with its dielectric thickness and copper weight according to the electrical, mechanical, and environmental requirements of advanced applications, such as 5G networks or satellite communications (satcom) systems.
Isola’s professionals will be at the 2022 TPCA to advise on which of their materials work the best with different circuit applications. For example, Astra® MT77 laminates and prepregs feature low signal loss for HSD and RF/microwave circuits and are unaffected by wide operating temperature ranges (-40 to +140°C). The materials provide the behavior of PTFE circuit materials but without the many processing steps required for PTFE-based circuits.
TPCA attendees in need of high-frequency operation and fast digital speeds can also select Isola’s I-Tera® MT40 laminates and prepreg materials as the foundations for compact, multilayer circuits. The materials support RF/microwave/mmWave circuits such as 77 GHz radars in advanced driver assistance system (ADAS) vehicular electronic safety systems and will be well suited for small cells in the mmWave portions (above 24 GHz) of 5G cellular wireless communications networks.
When lead-free, RoHS compatibility is an important circuit material requirement, Isola’s I-Speed® laminates and prepregs provide excellent thermal stability at high frequencies and fast digital speeds. Based on a reliable, low-loss UV-blocking epoxy resin system, I-Speed circuit materials are FR-4 process compatible for flexibility in manufacturing multilayer circuit assemblies that include FR-4 layers.
Choosing a circuit material that provides high performance at reasonable cost and with realistic manufacturing requirements often comes to the flip of a coin. But with a visit to Isola booth N-411 at the 2022 Taiwan PCB & Assembly (TPCA) Show, and the help of the engineering professionals from Isola Asia Pacific (Taiwan) Inc, the guesswork can be left outside the exhibition hall, especially for those circuit applications reach into the RF, microwave, mmWave, and HSD operating ranges.
Share on:
Suggested Items
ICT Spring Seminar: Nickel Not Welcome Here
03/12/2025 | Pete Starkey, I-Connect007After a miserable, dull, and damp English winter, a really pleasant nearly spring day with the sun shining and daffodils in bloom greeted delegates to the Institute of Circuit Technology Spring Seminar at Puckrup Hall near Tewkesbury, March 5, in Gloucestershire, UK.
Multicircuits Expands Capabilities with State-of-the-Art Automated Copper Via Fill Process
03/10/2025 | MulticircuitsMike Thiel, president of Multicircuits, a leading provider of high-reliability printed circuit boards, has announced the addition of a state-of-the-art automated copper via fill process to their advanced manufacturing capabilities. This strategic investment enhances the company’s ability to deliver cutting-edge solutions for demanding industries, including aerospace, defense, medical, and high-speed telecommunications.
EIPC 2025 Winter Conference, Day 2: A Roadmap to Material Selection
02/20/2025 | Pete Starkey, I-Connect007The EIPC 2025 Winter Conference, Feb. 4-5, in Luxembourg City, featured keynotes and two days of conference proceedings. The keynote session and first-day conference proceedings are reported separately. Here is my review of the second day’s conference proceedings. Delegates dutifully assembled bright and early, well-rested and eager to participate in the second day’s proceedings of the EIPC Winter Conference in Luxembourg.
Designers Notebook: Addressing Future Challenges for Designers
02/06/2025 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board is and will probably continue to be the base platform for most electronics. With the proliferation of new generations of high I/O, fine-pitch surface mount semiconductor package variations, circuit interconnect is an insignificant factor. Circuit board designers continually face challenges such as component quantity and complexity, limited surface area, and meeting the circuit board’s cost target. The printed circuit design engineer’s prominent position demands the development of efficiently manufacturable products that perform without compromise.
DesignCon 2025, Day 2: It’s All About AI
01/30/2025 | Marcy LaRont, I-Connect007It’s hard to get away from the topic of artificial intelligence, but why would you? It’s everywhere and in everything, and my time attending presentations about AI at DesignCon 2025 was well worth it. The conference’s agenda featured engaging presentations and discussions focused on the technological advancements in AI, big data centers, and memory innovations, emphasizing the critical relationship between processors and circuit boards.