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Isola Reaches Higher in Frequency at 2022 TPCA Show in Taipei
October 21, 2022 | IsolaEstimated reading time: 2 minutes
Isola Asia Pacific will be well represented by its circuit material experts at the 2022 Taiwan PCB & Assembly (TPCA) Show, as they advise attendees on the optimum uses of their materials for the growing numbers of high-frequency analog and high-speed-digital (HSD) electronic circuit applications. The event, with its engineering conference and traditionally lively exhibition hall, is a popular meeting place for professional users of printed-circuit board (PCB) materials. The show, which began in 2000, is scheduled for October 26-28, 2022, in the TWTC Nangang Exhibition Hall (Taipei, Taiwan). Isola’s design and application advisors, from the Isola Asia Pacific division (Taoyuan, Taiwan), will be available all three days of the exhibition at Booth N-411. The knowledgeable Isola TPCA booth team can help attendees with the fine points of specifying a circuit material along with its dielectric thickness and copper weight according to the electrical, mechanical, and environmental requirements of advanced applications, such as 5G networks or satellite communications (satcom) systems.
Isola’s professionals will be at the 2022 TPCA to advise on which of their materials work the best with different circuit applications. For example, Astra® MT77 laminates and prepregs feature low signal loss for HSD and RF/microwave circuits and are unaffected by wide operating temperature ranges (-40 to +140°C). The materials provide the behavior of PTFE circuit materials but without the many processing steps required for PTFE-based circuits.
TPCA attendees in need of high-frequency operation and fast digital speeds can also select Isola’s I-Tera® MT40 laminates and prepreg materials as the foundations for compact, multilayer circuits. The materials support RF/microwave/mmWave circuits such as 77 GHz radars in advanced driver assistance system (ADAS) vehicular electronic safety systems and will be well suited for small cells in the mmWave portions (above 24 GHz) of 5G cellular wireless communications networks.
When lead-free, RoHS compatibility is an important circuit material requirement, Isola’s I-Speed® laminates and prepregs provide excellent thermal stability at high frequencies and fast digital speeds. Based on a reliable, low-loss UV-blocking epoxy resin system, I-Speed circuit materials are FR-4 process compatible for flexibility in manufacturing multilayer circuit assemblies that include FR-4 layers.
Choosing a circuit material that provides high performance at reasonable cost and with realistic manufacturing requirements often comes to the flip of a coin. But with a visit to Isola booth N-411 at the 2022 Taiwan PCB & Assembly (TPCA) Show, and the help of the engineering professionals from Isola Asia Pacific (Taiwan) Inc, the guesswork can be left outside the exhibition hall, especially for those circuit applications reach into the RF, microwave, mmWave, and HSD operating ranges.
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Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.