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Vern Solberg: A Designer's Focus on High Density

04/30/2026 | Marcy LaRont, I-Connect007 Magazine
Vern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.

Happy Holden: A Relentless Pursuit of Knowledge

12/24/2025 | Marcy LaRont, I-Connect007
Known as the godfather of PCB process technology, Happy’s Tech Talk columnist Happy Holden has spent over 50 years advancing electronics manufacturing. In this profile, Happy shares stories from HP, Foxconn, and beyond—highlighting a career defined by curiosity, mentorship, and a relentless passion for learning that continues to shape our industry.

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Real Time with... IPC APEX EXPO 2025: Akrometrix—Creative Approaches to Measuring Thermal Warpage

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Neil Hubble discusses his research on measuring thermal warpage which focuses on challenges in testing small, thin samples. He introduces non-destructive testing methods that effectively measure without damaging components. Neil highlights the industry's growing interest in AI and outlines future technology goals, including improved resolution and automation to enhance production efficiency.

nVent SCHROFF Introduces Enhanced PCB Extraction in Rugged Environments

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