Flexible Thinking: Rules of Thumb—A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
MKS’ Atotech to Participate at Semicon Europa 2022
November 2, 2022 | AtotechEstimated reading time: 1 minute
MKS’ Atotech will be exhibiting at Semicon Europa and present its latest results on Cu-to-Cu direct bonding for 3D integration during Advanced Packaging Solutions Conference (APC) in Munich on November 16 from 11:50 a.m. – 12:10 p.m. (room 14c; presenter: Ralf Schmidt, R&D Manager Semiconductor).
The company’s Semiconductor Advanced Packaging and Lead Frame Package experts will be highlighting latest manufacturing solutions for ENEPIG for pad metallization and RDL housing, pillar, RDL and lead frame applications, as well as be available for detailed discussions around other production trends at booth 165 in hall C1.
ENEPIG for pad metallization and RDL housing:
- Xenolyte® Ni: Electroless Ni plating for all requirements
- Xenolyte® Au: Reliable immersion and autocatalytic Au solutions
- Xenolyte® Pd HS: Pure electroless Pd deposits for high reliabilities
Pillar applications:
- Spherolyte® Cu UF 5: Tailorable and pure high-speed copper pillar plating
- Spherolyte® Ni: All liquid component ECD Ni electrolyte for highly uniform plating
- Spherolyte® SnAg: High-speed SnAg for lead-free, pure and uniform solder bump plating
RDL applications:
- Spherolyte® Cu UF 3: Copper RDL process for purest line plating and micro via filling
- Promobond® AP2: Adhesion promoter for reliability improvement of next-generation Cu deposits
Leadframe applications:
- AgPrep: Ultimate non-etching adhesion promoter for silver surfaces
- ppfPrep: NEAP for excellent adhesion and significant cost savings
Share on:
Suggested Items
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
SolderKing Celebrates a Year of Expansion, Innovation, and Sustainability Achievements
12/09/2024 | SolderKing Assembly Materials Ltd,SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, has wrapped up 2024 with a series of milestones that reflect its ongoing growth and commitment to innovation.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in