Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Stocks Tumble as Nvidia Warns of Major Hit From U.S.-China Export Curbs

04/17/2025 | I-Connect007 Editorial Team
U.S. stocks slid sharply Wednesday after Nvidia warned that new U.S. export restrictions on chips to China could slash billions from its revenue, deepening investor anxiety over the broader economic fallout of President Donald Trump’s ongoing trade war.

Samsung and Google Cloud Expand Partnership

04/09/2025 | PRNewswire
Samsung Electronics Co., Ltd and Google Cloud today announced an expanded partnership to bring Google Cloud's generative AI technology to Ballie, a new home AI companion robot from Samsung.

Insulectro Technology Village to Feature 35 Powerchats at IPC APEX EXPO 2025

03/11/2025 | Insulectro
Insulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, will present its popular and successful 13.5-minute PowerChats™ during this year’s IPC APEX EXPO at the Anaheim Convention Center, March 18-20, 2025.

Drip by Drip: Semiconductor Water Management Innovations

03/05/2025 | IDTechEx
Not only does semiconductor manufacturing require large volumes of energy, chemicals, and silicon wafers, it also requires vast volumes of water. IDTechEx’s latest report, “Sustainable Electronics and Semiconductor Manufacturing 2025-2035: Players, Markets, Forecasts”, forecasts water usage across semiconductor manufacturing to double by 2035, as demand for integrated circuits continues to rise. 

Pusan National University Develops One-Step 3D Microelectrode Technology for Neural Interfaces

02/28/2025 | PRNewswire
Neural interfaces are crucial in restoring and enhancing impaired neural functions, but current technologies struggle to achieve close contact with soft and curved neural tissues. Researchers at Pusan National University have introduced an innovative method—microelectrothermoforming (μETF)—to create flexible neural interfaces with microscopic three-dimensional (3D) structures.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in