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Suggested Items

Zhen Ding’s Chairman Charles Shen Shares 10 Life Lessons with Graduates

05/27/2025 | Zhen Ding
At the 2025 Commencement Ceremony, Yuan Ze University sincerely invites a renowned yet low-profile figure in the PCB industry, Chairman Charles Shen of Zhen Ding Technology Group, as the keynote speaker.

Incap UK Invests in SMT Technology as Part of Long-Term Operational Development

05/23/2025 | Incap
Incap Electronics UK has completed the second phase of SMT (surface-mount technology) production lines upgrade at its facility in Newcastle-under-Lyme.

Geopolitical Tensions Fuel a Wave of AI Chip Independence as US and Chinese CSPs Race to Develop In-House ASICs

05/15/2025 | TrendForce
TrendForce’s latest research reveals that the surge in demand for AI servers is accelerating the pace at which major US CSPs are developing in-house ASICs, with new iterations being released every one to two years. In China, the AI server market is adjusting to new US export controls introduced in April 2025, which are expected to reduce the share of imported chips (e.g., from NVIDIA and AMD) from 63% in 2024 to around 42% in 2025.

IPC White Paper Maps the Regulatory Terrain for Electronics Suppliers in E-Mobility Sector

05/07/2025 | IPC
Electronics suppliers supporting the rapidly growing e-mobility sector are facing a dramatic escalation in environmental and social governance (ESG) compliance expectations. A new white paper from IPC’s e-Mobility Quality and Reliability Advisory Group provides a comprehensive overview of the evolving regulatory landscape and outlines the data infrastructure needed to stay ahead.

Siemens, Intel Foundry Advance Collaboration

04/30/2025 | Siemens Digital Industries Software
Siemens Digital Industries Software announced that its continued collaboration with Intel Foundry has resulted in multiple product certifications, updated foundry reference flows, and additional technology enablement leveraging the foundry’s leading-edge technologies for next-generation integrated circuits (IC) and advanced packaging.
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