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Murray Percival Co. Brings Apollo Seiko into Altronic Hoerbiger
December 12, 2022 | Murray Percival CompanyEstimated reading time: 1 minute
The Murray Percival Company, the leading supplier to the Midwest’s electronics industry, and 2022 GLOBAL Technology Award recipient for Distributor of the Year – Americas, is pleased to announce the sale of an Apollo Seiko J-CAT Lyra soldering robot to Altronic Hoerbiger in Girard, OH. This capital win was facilitated by Murray Percival’s own Josh Funk.
“Our initial goal in implementing soldering robots into our manufacturing process was to improve the speed and efficiency of soldering components,” commented Alyssa Garrett, Manufacturing Robotics Engineer, Altronic Hoerbiger. “Having a soldering robot improves the consistency and speed of our assembly process while also freeing up the operator to complete tasks while the robot is running.”
The J-CAT Lyra is a new soldering robot with significantly improved base operational features, increased usability and durability.
Apollo has excellent customer service and is located in the United States. Apollo’s process monitoring camera system allows operators to view each soldering joint as it is being formed. Machine capabilities allow the user to solder virtually any board by allowing control of changing temperatures, timing, and soldering techniques. Usability in Apollo robots is key for any production floor. Additionally, the robots are user-friendly for operators of all levels, as well as engineers.
“Our process has improved greatly with consistency and speed,” added Garrett. “The soldering robot allows our operators to complete various tasks while the robot is soldering. We currently use three soldering robots for production, essentially giving us three full-time soldering operators that are quick and efficient. It also has allowed us to meet high consistency quality requirements for our end-use customers on high-reliability product applications.”
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Rachael Temple - AlltematedSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.