-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
StenTech to Introduce Advanced Nano Durable Stencil Coating at APEX 2023
December 12, 2022 | StenTechEstimated reading time: 1 minute

StenTech Inc., the leading provider of stencils to the electronics manufacturing industry in North America, will introduce its new Advanced Nano Coating at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. Additionally, the company will have its complete product line of various stencils and tooling on display – Meet with the StenTech team in Booth #2150.
With the continued miniaturization of electronic packaging, the challenge continues to have the ability to get enough solder paste down in the right geometry shape to not only place the component to solder, but also to meet the ever-changing IPC requirements.
Advanced Nano is a highly unique coating that is applied to the bottom side of the stencil and inside the apertures, the squeegee side remains uncoated. This coating provides the stencil with anti-adhesion properties. Advanced Nano utilizes a specialized 1-3 um hardened nano coating. This permanent hydrophobic and oleophobic coating repels solder flux, allowing increased transfer of paste.
Advanced Nano increases transfer efficiency up to 25 percent, and enables significantly less bridging due to its paste efficiency benefits. Due to the anti-adhesion or "non-stick" characteristics, underside cleaning is reduced, giving customers a better yield and less expense on rework and touch-up. Stencils coated with Advanced Nano are ready for use just 30 minutes after coating.
StenTech has been leading the way in stencil technology, being the first company to introduce Fiber Diode lasers into North America. With more than 30 experienced CAD designers, their strength is the support they provide in stencil modifications, materials and thickness recommendations. StenTech offers a complete array of stencil technology, custom-tailored to suit your manufacturing requirements. They manufacture all types of stencils for the SMT industry.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.