The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Hitachi High-Tech Launches High-Throughput and High-Sensitivity Wafer Surface Inspection System LS9600
December 13, 2022 | JCN NewswireEstimated reading time: 1 minute
Hitachi High-Tech Corporation announced the launch of the LS9600, a new system for detecting particles and defects on non-patterned wafer surfaces. It features a new high-output, short-wavelength laser that improves throughput at the sensitivity levels required for the mass production of cutting-edge semiconductor devices by approx. 2.6 times compared to our previous generation systems. By introducing this product, Hitachi High-Tech will continue to help to improve yields and reduce inspection costs associated with customers' mass production of semiconductor devices.
Development Background
Non-patterned wafer inspection systems are used for applications such as controlling the condition (cleanliness) of non-patterned wafers to manage particles and defects in semiconductor device manufacturing equipment. Due to the shrinking of semiconductor devices, the defects of interest (DOIs), which impact yield during the manufacturing process, have also become smaller in size. As a result, there is a growing need for high-sensitivity inspection that can detect DOIs of 20 nm and smaller across the entire surface of non-patterned wafers. In addition to high-sensitivity inspection to improve yield, there is also a strong demand for high throughput, which leads to lower inspection costs.
Key New Technologies
This system achieves both high sensitivity and high throughput by implementing the following new technologies.
1. High-Output, Short-Wavelength Laser
The deep-ultraviolet laser has a higher output and shorter wavelength than legacy systems, which increases the amount of light scattered by microscopic defects, thereby achieving a higher degree of sensitivity.
2. New Optical Detection System
The new optical detection system features a larger surface area to capture light scattered by DOIs compared to the legacy systems. In addition, its newly developed high-sensitivity sensor has improved the detection rate of weak scattered light by around 20%.
3. New Data Processing System
Improved scattered light data-processing algorithms deliver higher sensitivity, together with higher throughput due to high-speed, real-time data processing.
By using this product, as well as our wafer optical inspection systems, and electron beam-based products such as a traditional CD-SEM and DR-SEM, Hitachi High-Tech is working to meet customers' various needs in processing, measurement, and inspection throughout the semiconductor manufacturing process. We will continue to provide innovative and digitally enhanced solutions to our products for the upcoming technology challenges, and create new value together with our customers, as well as contributing to cutting-edge manufacturing.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Elementary, Mr. Watson: High Power: When Physics Becomes Real
10/15/2025 | John Watson -- Column: Elementary, Mr. WatsonHave you ever noticed how high-speed design and signal integrity classes are always packed to standing room only, but just down the hall, the session on power electronics has plenty of empty chairs? It's not just a coincidence; it's a trend I've observed over the years as both an attendee and instructor.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
Bluepath Robotics Optimizes AMR Fleets with Inductive Charging Solution from Wiferion
10/09/2025 | WiferionIn a dynamic and highly competitive industry such as logistics, efficient and uninterrupted material flows are of crucial importance. To ensure maximum uptime for its robots, Bluepath Robotics, which specializes in autonomous mobile robots (AMR), needed a reliable and powerful power supply.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.