Hamamatsu Photonics Adopts Siemens‘ mPower for Optical Semiconductor Design
December 15, 2022 | SiemensEstimated reading time: 2 minutes

Siemens Digital Industries Software announces that Hamamatsu Photonics K.K. (Hamamatsu Photonics), a leading provider of optical semiconductor devices, has adopted Siemens' award-winning mPower™ digital software for the power integrity analysis of its next generation of optical semiconductor devices.
By pursuing further advancement of photoelectric conversion technology to discover the true nature of light, Hamamatsu Photonics delivers high-sensitivity, fast-response and high-performance optical semiconductor devices. The company provides a wide range of products such as photodiodes, photo ICs, image sensors, infrared detection devices and LED offerings – all of which support multiple wavelength ranges (e.g., infrared, visible, ultraviolet, x-ray, high-energy). The products are widely used in many applications, including the scientific measurement, medical and automotive markets.
“Power integrity analysis is a critical technology for us, because our optical IC products need to achieve extremely high performance and reliability in order to meet stringent functionality requirements,” said Masaaki Matsubara, manager for the second design group, Design Center, Solid State Division for Hamamatsu Photonics. “We believe Siemens’ mPower digital software is our best option for improving IC performance and reliability. Our designers use the mPower solution to analyze their designs at early stages of development, and the software definitely helps to optimize the power source design faster.”
Introduced last year, Siemens’ mPower solution aids customers to more quickly and accurately perform sign-off analysis of the power, electromigration and IR-drop performance of integrated circuits (ICs), helping them to confirm that their as-implemented design will meet performance and reliability targets when manufactured.
Siemens’ mPower digital software provides power integrity analysis with high accuracy through fast and efficient distributed processing. Featuring an intuitive graphical user interface for optimal ease-of-use, the solution supports analysis across the IC design process, from initial concept design to design sign-off, helping users to create better designs with no compromise in quality or speed. For optimal reliability and IC traceability, the mPower solution also integrates seamlessly with Siemens’ Calibre® RVE software, which is part of its industry-leading Calibre® platform for IC physical verification.
“As image sensors grow in size and complexity, it becomes both harder and more critical to verify the power integrity of these very large designs,” said Joe Davis, senior director for Interfaces and EM/IR Product Management for Siemens EDA. “Hammamatsu Photonics quickly determined that the mPower solution provides the capacity, performance, and integration that they need in order to bring high performance, high resolution sensors to the market and we look forward to working with them as they bring more advanced designs to the market.”
Suggested Items
Microchip Enters into Partnership Agreement with Delta Electronics on Silicon Carbide Solutions
07/18/2025 | Globe NewswireThe growth of artificial intelligence (AI) and the electrification of everything are driving an ever-increasing demand for higher levels of power efficiency and reliability.
ESD Alliance Reports Electronic System Design Industry Posts $5.1 Billion in Revenue in Q1 2025
07/16/2025 | SEMIElectronic System Design (ESD) industry revenue increased 12.8% to $5,098.3 million in the first quarter of 2025 from the $4,521.6 million registered in the first quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.
Beyond Design: Refining Design Constraints
07/17/2025 | Barry Olney -- Column: Beyond DesignBefore starting any project, it is crucial to develop a thorough plan that encompasses all essential requirements. This ensures that the final product not only aligns with the design concept but is also manufacturable, reliable, and meets performance expectations. High-speed PCB design requires us to not only push technological boundaries but also consider various factors related to higher frequencies, faster transition times, and increased bandwidths during the design process.
Prague PEDC: Call for Abstracts Deadline July 31
07/16/2025 | Pan-European Electronics Design Conference (PEDC)The second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline is July 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
The Pulse: Design Constraints for the Next Generation
07/17/2025 | Martyn Gaudion -- Column: The PulseIn Europe, where engineering careers were once seen as unpopular and lacking street credibility, we have been witnessing a turnaround in the past few years. The industry is now welcoming a new cohort of designers and engineers as people are showing a newfound interest in the profession.