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PDR to Unveil New Automated Rework System with uPID Technology at APEX
December 15, 2022 | PDREstimated reading time: 1 minute
PDR will exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The PDR team will introduce several new systems including the new IR-E5 Automated Rework System, upgraded E6XL and GenX90PDT XRAY System in Booth #3024.
The new IR-E5 Automated Rework System features PDR’s new Advanced Control System with uPID Technology and ThermoActive Suite Software Upgrade. The system offers advanced Thermocontrol and embedded Profile IQ assistant, gram force control for solder paste deposition, semi-automated machine vision component align/placement and automated component removal. Also, a newer form factor for this model to enhance Benchtop placement.
The IR-E6 XL Evolution Series has been upgraded to include the New Advanced Control System with uPID Technology and ThermoActive Suite Software Upgrade. The system now has even more advanced Thermocontrol and embedded Profile IQ assistant. The IR E6-XL is an ultimate performance, BGA rework station for small to large PCBs up to 24"/620mm.
PDR’s new integrated Print Part System and Reballing System for all PDR Evolution Series Rework Systems also will be available demos during the IPC APEX EXPO. PDR’s latest reball system now incorporates both solder paste application and reball sphere attach in one easy-to-use system, incorporating advanced nano-technology for a clean, high precision reball method for rework.
The PDR Print Part System mounts directly to all PDR Evolution Series Rework platforms for direct vertical lift utilizing PDR’s Integrated Vacuum Pick Up Feature/Gram Force placement settings. Designed for integration into your rework process when using PDR Systems, the PDR Print Part System also can be used as a stand-alone device for general printing of solder paste to component.
From the X-ray Solutions side, the new GenX90PDT X-ray System will be on display. The 3D X-ray System utilizes DTS Technology to render 3D images. The System also eliminates the need for a flying head detector, which means the cabinet is smaller with less moving parts to maintain than conventional 3D X-ray systems, while still able to hold boards up to 21”.
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Simon Khesin - Schmoll MaschinenSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.