Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
PDR to Unveil New Automated Rework System with uPID Technology at APEX
December 15, 2022 | PDREstimated reading time: 1 minute
PDR will exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The PDR team will introduce several new systems including the new IR-E5 Automated Rework System, upgraded E6XL and GenX90PDT XRAY System in Booth #3024.
The new IR-E5 Automated Rework System features PDR’s new Advanced Control System with uPID Technology and ThermoActive Suite Software Upgrade. The system offers advanced Thermocontrol and embedded Profile IQ assistant, gram force control for solder paste deposition, semi-automated machine vision component align/placement and automated component removal. Also, a newer form factor for this model to enhance Benchtop placement.
The IR-E6 XL Evolution Series has been upgraded to include the New Advanced Control System with uPID Technology and ThermoActive Suite Software Upgrade. The system now has even more advanced Thermocontrol and embedded Profile IQ assistant. The IR E6-XL is an ultimate performance, BGA rework station for small to large PCBs up to 24"/620mm.
PDR’s new integrated Print Part System and Reballing System for all PDR Evolution Series Rework Systems also will be available demos during the IPC APEX EXPO. PDR’s latest reball system now incorporates both solder paste application and reball sphere attach in one easy-to-use system, incorporating advanced nano-technology for a clean, high precision reball method for rework.
The PDR Print Part System mounts directly to all PDR Evolution Series Rework platforms for direct vertical lift utilizing PDR’s Integrated Vacuum Pick Up Feature/Gram Force placement settings. Designed for integration into your rework process when using PDR Systems, the PDR Print Part System also can be used as a stand-alone device for general printing of solder paste to component.
From the X-ray Solutions side, the new GenX90PDT X-ray System will be on display. The 3D X-ray System utilizes DTS Technology to render 3D images. The System also eliminates the need for a flying head detector, which means the cabinet is smaller with less moving parts to maintain than conventional 3D X-ray systems, while still able to hold boards up to 21”.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.