Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
ZESTRON to Present on Defluxing Ultra-Fine Pitch Die on CoWs at IPC APEX 2023
December 21, 2022 | ZESTRONEstimated reading time: Less than a minute
ZESTRON, a leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that ZESTRON’s Senior Application Engineer, Ravi Parthasarathy will be presenting, “Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs”, at IPC APEX 2023 taking place in San Diego, California.
CoW (Chip on Wafer) is the next generation of CoS (Chip on Substrate) that first combines the chips to the interposer, adds wafer-level molding, and finally, they are connected to the flip chip (FC) substrate. This technology makes a better physical structure for accommodating very large die and larger overall interposer dimensions.
A continuation from the technical paper presented at APEX 2022 and titled “Defluxing of Copper Pillar Bumped Flip Chips,” this new study concentrates on cleaning under the next level of ultra-fine pitch CoW devices down to less than 25?m bump pitch and bump counts of more than 150K. This study focuses on the impact of wash temperatures and conveyor belt speed utilizing analytical/functional testing, including Visual Inspection, FTIR with color mapping, and SEM/EDX to assess cleanliness.
Share on:
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.