L3Harris Announces Divestiture of Visual Information Solutions Business
December 23, 2022 | Business WireEstimated reading time: Less than a minute

L3Harris Technologies announced the signing of a definitive agreement with NV5 Global Inc. to divest its Visual Information Solutions business with an anticipated benefit up to $100 million. The transaction is expected to close mid-2023, subject to required regulatory approvals and other customary closing conditions.
The divestiture is consistent with the company’s broader strategy to continue portfolio optimization, and to align long-term innovation investments for national security priorities and whole-of-government, multi-domain solutions.
In October, L3Harris entered into an agreement to acquire ViaSat’s Tactical Data Link product line in order to modernize the Link 16 network to provide more resilient, multi-domain communications for the DoD, and that effort obtained comprehensive regulatory approval earlier this week. In December, L3Harris entered into an agreement to acquire Aerojet Rocketdyne, a key supplier of propulsion systems and energetics to the DoD, NASA and other partners and allies worldwide.
L3Harris Visual Information Solutions is a global provider of commercial geospatial software, technology and services used to extract and analyze reliable, accurate and actionable information from geospatial to terrestrial imagery.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Marcy’s Musings: Advancing the Advanced Materials Discussion
09/17/2025 | Marcy LaRont -- Column: Marcy's MusingsAs the industry’s most trusted global source of original content about the electronics supply chain, we continually ask you about your concerns, what you care about, and what you most want to learn about. Your responses are insightful and valuable. Thank you for caring enough to provide useful feedback and engage in dialogue.
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Element Solutions Declares Q3 Dividend of $0.08 Per Share
08/22/2025 | BUSINESS WIREElement Solutions Inc announced that its board has declared a quarterly cash dividend of $0.08 per share of the company's common stock. The declared dividend will be paid on September 15, 2025 to stockholders of record as of the close of business on September 2, 2025.
Polymatech Electronics Limited Announces Completion of PCB Manufacturing Facility in Europe
08/15/2025 | PR NewswirePolymatech Electronics Limited is thrilled to announce the successful commissioning of its state-of-the-art Printed Circuit Board (PCB) manufacturing facility in Estonia, Europe. This milestone represents a significant advancement in the company's strategic expansion across the European market.