SIA Applauds Increased Funding for Research, Workforce Development in Year-End Funding Package
December 26, 2022 | SIAEstimated reading time: Less than a minute
The Semiconductor Industry Association (SIA) released the following statement from David Isaacs, SIA vice president of government affairs, regarding the inclusion of additional funding for key research agencies in the fiscal year 2023 (FY2023) Omnibus. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
“Building off the important investments made by the CHIPS and Science Act, SIA applauds increased funding for research and workforce development in the FY2023 Omnibus. Once passed, these investments will help advance innovation, strengthen the American STEM workforce, promote economic growth, and maintain national security by reinforcing the National Science Foundation (NSF), regional technology hubs, and the National Institute of Standards and Technology (NIST) manufacturing programs. While the funding is below the authorization levels in the CHIPS and Science Act, it nonetheless represents a positive step in enhancing the U.S. research enterprise and workforce development. We look forward to working with the new Congress and the administration next year to further prioritize American science and technology leadership for the future.”
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).