Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
American Made Advocacy: Congress Back from Break With Work To Do
The Most-read I-Connect007 Articles of 2022
December 26, 2022 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Each December, we like to look back at the most popular articles of the past 12 months. You never know which article is going to blow up like an Avril Lavigne album
So, grab a cup of eggnog and curl up by the fire! For your holiday enjoyment, here’s a blast from the past: the top five most-read I-Connect007 articles of 2022.
Review: Institute of Circuit Technology 2022 Annual Symposium
Once again, European Technical Editor Pete Starkey holds onto the top spot. Pete covers conferences and trade shows around Europe. Everything Pete writes is golden, and he has fans across Europe and around the world. Stop by our booth at IPC APEX EXPO and say hi to Pete.
Jahr Turchan Discusses Blackfox's Training Scholarships for Veterans
Nolan Johnson’s interview with Jahr Turchan of Blackfox Training Institute drew a lot of eyes to the page. There’s a shortage of subject matter experts in the industry, and Blackfox’s Veteran Advanced Manufacturing Certification program is helping bring transitioning veterans into the workplace. We need more ideas like this.
Finally! A Book About PCB Stackups
The PCB design industry is hungry for information about stackup design, and Bill Hargin of Z-zero seems to have written the right book at the right time. This I-Connect007 eBook has been flying off the virtual bookshelves all year. It would make a perfect late Christmas present.
PCB Plating Still Comes Down to Physics
As I said, we never know what articles are going to hit it big each year. This interview with columnist Michael Carano covered the ins and outs of plating technologies and processes, which might seem like a fairly “mature” topic. But this interview drew big numbers. Readers are looking for information, and we seem to have what they’re looking for.
A Definitive Review of New Expert Guide to High-Performance Materials
This year, we published a variety of eBooks on topic from across the spectrum. Happy Holden’s review of the I-Connect007 eBook The Printed Circuit Designer’s Guide to… High Performance Materials really took off. As Happy explains, this book, written by Michael Gay of Isola, lays out everything you need to know about high performance PCB materials.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.