Driving Innovation: Inner Layer Alignment Methods in PCB Production
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
It’s Only Common Sense: Sales as a Team Sport
New Clean Energy Consortium in California First Platform to Expand Green Technologies
December 28, 2022 | PRNewswireEstimated reading time: 1 minute
American Clean Energy Group, a new consortium of clean energy companies, is about to build eight new manufacturing plants and help Northern California get back on its feet.
With modules that can store electricity electrostatically in a hybrid, graphene and solid-state Supercapacitors designed to charge in 30 minutes, ACE is now offering to assist Northern California recover from the massive power outages caused by the recent 6.4 magnitude earthquake.
"Now is the time for the affected people in California to know what is available and how ACE energy storage modules can keep the lights on. Our thoughts are with the people of Northern California," says Brad Bickel, CMO/Managing Partner of American Clean Energy Group.
Based in Sheridan, Wyo. and with offices in New York City and Denver, Colo., American Clean Energy Group is a consortium of existing companies with proven track records in the clean technology space. The arrangement offers extensive manufacturing capabilities, renewable energy designs, and engineering background and know-how with an existing worldwide network of distributors.
ACE offers a range of non-chemical/non-lithium ion-powered storage modules designed to quickly and efficiently deliver hours of electrical power to homes and businesses. The consortium also has developed the first advanced energy storage platform focusing on green technologies.
With a mission to establish multiple world-class supercapacitor non-chemical battery manufacturing, warehousing, training, and technical facilities, ACE group is poised to expand. The company is scheduled to build eight manufacturing plants in the United States starting in the first quarter of 2023, according to the CEO & Managing partner Herve Ime.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Review: PCEA Orange County Summer Meeting
08/06/2025 | Dan Feinberg, Technology Editor, I-Connect007The Printed Circuit Engineering Association (PCEA) represents a community of engineers, designers, and industry influencers dedicated to the advancement of PCB technology, design, and manufacturing, and the growth and knowledge of its membership. PCEA regularly hosts events to share the latest developments, best practices, and visions for the future of electronic design and manufacturing. The Orange County chapter seems to be one of the largest and most active ones and I was invited to attend the latest chapter event on July 24 in Costa Mesa, California.
Benchmark Announces Appointment of Chuck Swoboda to Board of Directors
08/05/2025 | Benchmark Electronics Inc.Benchmark Electronics, Inc., a global provider of engineering, design, and manufacturing services, announced the appointment of Charles “Chuck” Swoboda to its Board of Directors.
Federal Electronics Marks 10th Year of ISO 13485 Certification with Successful 2025 Surveillance Audit
08/05/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has successfully completed its 2025 ISO 13485:2016 surveillance audit at the company’s Cranston, Rhode Island facility.
Report: Green Electronics Market to Hit $46.53B by 2029
08/05/2025 | Globe NewswireAccording to the Green Electronics Manufacturing Market Report 2025, this sector will grow from $16.81 billion in 2024 to $20.66 billion in 2025 at a compound annual growth rate (CAGR) of 22.9%.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.