-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
New iNEMI Project on High Density Interconnect Socket Warpage Prediction
December 30, 2022 | iNEMIEstimated reading time: 1 minute

iNEMI announces call-for-participation webinar on high density interconnect socket warpage prediction and characterization, phase 2 on January 5-6, 2023.
High-density interconnect sockets are becoming larger, which creates challenges for socket warpage simulation and can impact SMT assembly yield and reliability. Expedited computation that maintains the required level of accuracy is needed to shorten socket design cycles.
Phase 1 of iNEMI’s High-Density Interconnect Socket Warpage Prediction and Characterization project established an analysis and validation framework for socket development, conducted simulation experiments, and initially investigated the impact of socket design, fiber filled material properties and molding process conditions on socket warpage.
Phase 2 will focus on improving socket warpage simulation accuracy and speed, further investigating the impact of molding and design on socket warpage, and will ultimately establish guidelines for dynamic socket warpage measurement and prediction. If you are involved in socket design and development, board assembly and/or reliability, this project will be of interest to you. Please join us to learn more on January 5 or 6. The deadline to sign up for the project is February 17, 2023.
Registration
This webinar is open to industry; advance registration is required For additional information, visit iNEMI's website.
Session 1
Thursday, January 5, 2023
7:00-8:00 a.m. EST (U.S.)
1:00-2:00 p.m. CET (Europe)
8:00-9:00 p.m. CST (China)
Session 2
Friday, January 6
9:00-10:00 a.m. CST (China)
8:00-9:00 p.m. EST (U.S.) on January 5
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
The Global Electronics Association Launches Design Village at APEX EXPO 2026
09/02/2025 | Global Electronics AssociationAPEX EXPO, the hallmark electronics tradeshow hosted by the Global Electronics Association, announced the launch of the Design Village, a new feature in the exhibit hall that will unite the world’s leading innovators and showcase next-generation solutions for the electronics industry.
Mastering PCB Floor Planning
08/28/2025 | Stephen V. Chavez, Siemens EDAPlacement of PCB components is far more than just fitting components onto a board. It’s a strategic and critical foundational step, often called “floor planning,” that profoundly impacts the board’s performance, reliability, manufacturability, and cost. Floor planning ties into the solvability perspective, with performance and manufacturability being the other two competing perspectives for addressing and achieving success in PCB design.
Elementary Mr. Watson: Routing Hunger Games—May the Traces Be Ever in Your Favor
08/26/2025 | John Watson -- Column: Elementary, Mr. WatsonI’d like to share a harsh truth, and I say this as a friend: PCB designers are often their own worst enemy. It’s rarely the complexity of the circuit, the last-minute changes from mechanical, the limited enclosure space, or the ever-expanding list of design rules that send projects to the dust heap of failed boards. More often, it's our own decisions, made too quickly and narrowly, and with too little foresight, that sabotage an otherwise good design.
Target Condition: Floor Planning Without a Floor
08/27/2025 | Kelly Dack -- Column: Target ConditionBy a show of hands, how many PCB designers have been asked to start a layout without a board outline, keep-out zones, or even height constraints? How many have had to work within a specific enclosure before the schematic was finalized? If this sounds familiar, you're not alone. Starting a PCB layout without critical constraints is like hiring an interior designer to buy furniture and carpet for a house you haven’t even purchased yet, or, even worse, trying to fit four bedrooms' worth of furniture in a one-room cabin.
I-Connect007 Editor's Choice: Five Must-Reads for the Week
08/22/2025 | Andy Shaughnessy, I-Connect007In this week’s roundup, we have a variety of articles covering design, manufacturing, sustainability, and, of course, tariff negotiations. We have a milestone anniversary to celebrate as well, with Dan Beaulieu about to publish his 1,000th column. When does Dan even sleep? Here’s to hoping that we have 1,000 more weeks of "It’s Only Common Sense."