It’s Only Common Sense: Customers Capabilities—and Confidence
Marcy’s Musings: Operating Without a Rulebook
Dan’s Biz Bookshelf: ‘The 'NVIDIA Way: Jensen Huang and the Making of a Tech Giant’
New iNEMI Project on High Density Interconnect Socket Warpage Prediction
December 30, 2022 | iNEMIEstimated reading time: 1 minute
iNEMI announces call-for-participation webinar on high density interconnect socket warpage prediction and characterization, phase 2 on January 5-6, 2023.
High-density interconnect sockets are becoming larger, which creates challenges for socket warpage simulation and can impact SMT assembly yield and reliability. Expedited computation that maintains the required level of accuracy is needed to shorten socket design cycles.
Phase 1 of iNEMI’s High-Density Interconnect Socket Warpage Prediction and Characterization project established an analysis and validation framework for socket development, conducted simulation experiments, and initially investigated the impact of socket design, fiber filled material properties and molding process conditions on socket warpage.
Phase 2 will focus on improving socket warpage simulation accuracy and speed, further investigating the impact of molding and design on socket warpage, and will ultimately establish guidelines for dynamic socket warpage measurement and prediction. If you are involved in socket design and development, board assembly and/or reliability, this project will be of interest to you. Please join us to learn more on January 5 or 6. The deadline to sign up for the project is February 17, 2023.
Registration
This webinar is open to industry; advance registration is required For additional information, visit iNEMI's website.
Session 1
Thursday, January 5, 2023
7:00-8:00 a.m. EST (U.S.)
1:00-2:00 p.m. CET (Europe)
8:00-9:00 p.m. CST (China)
Session 2
Friday, January 6
9:00-10:00 a.m. CST (China)
8:00-9:00 p.m. EST (U.S.) on January 5
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
FlashPCB Welcomes Adam Broeckert, EIT as Manufacturing Engineer
04/20/2026 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, is pleased to announce the addition of Adam Broeckert, EIT, as Manufacturing Engineer.
Single Pair Ethernet (SPE): A Valuable Option for Modern Designs
04/20/2026 | Marcy LaRont, I-Connect007When it comes to designing PCBs and full systems for increasingly complex electronics hardware, who doesn’t want to reduce complexity and cost? Single-Pair Ethernet (SPE) has emerged as a solution and is gaining rapid attention across industrial electronics and PCB design because it enables Ethernet communication over a single twisted pair, replacing the traditional two- or four-pair cabling used in standard Ethernet networks. This seemingly simple shift has significant implications for designers: smaller connectors, reduced cable weight, longer reach, and the ability to carry both data and power over a single pair.
DARPA Launches HARQ Program to Integrate Diverse Qubits for Scalable Quantum Computing
04/20/2026 | DARPADARPA has launched the Heterogeneous Architectures for Quantum (HARQ) program, an effort aimed at overcoming one of the most persistent barriers in quantum computing: how to move beyond single-technology systems to achieve and scale practical, high-impact applications.
Spirit Electronics Named Authorized Distributor for Microchip Technology
04/17/2026 | Globe NewswireSpirit Electronics, a vertically integrated electronics design and manufacturing solutions provider serving the military and aerospace markets, announced that it has been designated as an authorized distributor for the Americas for Microchip Technology, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions.
Cadence, NVIDIA Expand AI & Accelerated Computing Partnership
04/17/2026 | Cadence Design Systems, Inc.At CadenceLIVE Silicon Valley 2026, Cadence announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based simulation and digital twins to unlock new levels of productivity and accelerate next‑generation engineering design flows across semiconductor design, physical AI systems and hyperscale AI factories.