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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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MKS to Showcase Electronics Manufacturing and Precision Laser Solutions at electronica India 2026

09/08/2026 | MKS Inc.
MKS Inc. will showcase their latest innovations for electronics manufacturing at electronica India 2026, taking place September 16–18 at the Bangalore International Exhibition Centre (BIEC) in Bengaluru, India.

proteanTecs, MegaChips Partner on Health and Performance Solutions for Next-Gen LSIs

09/04/2026 | BUSINESS WIRE
proteanTecs®, the leading provider of health and performance management solutions for advanced electronics, announced it is collaborating with MegaChips on the integration of proteanTecs’ embedded monitoring technology into MegaChips’ next-generation ASIC and LSI digital systems.

Beyond the Chip: Indium Highlights AI Materials Solutions at SEMICON Taiwan 2026

09/04/2026 | Indium Corporation
As artificial intelligence (AI) and high-performance computing (HPC) continue to accelerate semiconductor innovation, the industry is moving beyond the challenge of building a more powerful chip. Increasingly complex packaging, higher power density, tighter thermal requirements, and demands for faster, more cost-effective manufacturing are making system-level performance and the broader manufacturing ecosystem critical to the next generation of AI.

Kulicke & Soffa Advances AI Infrastructure with CPO, Advanced Packaging

09/01/2026 | PRNewswire
Kulicke and Soffa Industries, Inc., a global leader in semiconductor and electronics assembly solutions, continues to strengthen its position as a critical enabler of next-generation artificial intelligence (AI) infrastructure through its advanced packaging portfolio, including Thermo-Compression Bonding (TCB) solutions which directly address emerging Co-Packaged Optics (CPO) applications.

Indium Expert to Present AI Packaging and High-Power Consumption Solutions at SEMICON Taiwan

08/31/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Jason Chou will discuss solutions designed to address the high-power consumption and complex packaging challenges of AI applications, from integrated circuits to full system assembly, at SEMICON Taiwan, September 2-4, in Taipei, Taiwan.
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