CES: Intel Extends Performance Leadership with World's Fastest Mobile Processor
January 4, 2023 | IntelEstimated reading time: 1 minute

At CES, Intel announced its 13th Gen Intel Core mobile processors that bring superior performance and experiences to mobile platforms. Intel introduced 32 new 13th Gen Intel Core mobile processors with a rich suite of features and capabilities for all laptop segments.
“The 13th Gen Intel Core mobile processor family delivers unrivaled, scalable performance for leadership platforms across all laptop segments,” said Michelle Johnston Holthaus, executive vice president and general manager of the Client Computing Group at Intel. “With our industry-leading technologies and unmatched global partner ecosystem, people can expect a high-caliber mobile experience in new and unique form factors – so they can game or create from anywhere.”
13th Gen Intel Core H-series Processors Deliver Industry-Leading Performance
Intel continues to push the boundaries of performance and expand computing possibilities for gamers and creators with the launch of the 13th Gen Intel Core H-series mobile processors, which includes the first 24-core processor for a laptop. When combined with unique features like support for both DDR4 and DDR5 memory, best-in-class connectivity and PCIe Gen 5, 13th Gen HX processors deliver the world’s best mobile gaming platform.
The new processor family offers:
- Up to 5.6 gigahertz (GHz) turbo frequency – the highest clock speed available for the laptop market – delivering up to 11% faster single-thread performance3 and 49% faster multitask performance over the previous generation.4
- Up to 24 cores (8 Performance-cores, 16 Efficient-cores), 32 threads and enhanced Intel® Thread Director.
- Full memory support of up to 128 gigabyte (GB) total for DDR5 (up to 5,600 megahertz) and DDR4 (up to 3,200 MHz).
- Intel® Killer™ Wi-Fi 6E (Gig+) for up to 6x faster internet speeds with no legacy Wi-Fi channel interference.5
- The latest in Bluetooth connectivity with Intel® Bluetooth LE Audio and Bluetooth 5.2 supporting up to 2x faster speeds and multiple device connections with lower power consumption.
- Thunderbolt™ 4 support, delivering transfer speeds up to 40 gigabits per second (Gbps) and PC connectivity to multiple 4K monitors and accessories.
- Improved integrated graphics experience based on improved driver stack and key learnings from Intel’s work with discrete graphics.
- Overclocking capabilities on all HX and HK SKUs.
With five times as many HX laptop designs powered by 13th Gen Intel Core mobile processors compared with 12th Gen, users can choose from 60 HX designs to stream, create and compete at the highest levels.
Suggested Items
Keysight, Synopsys Deliver an AI-Powered RF Design Migration Flow
06/06/2025 | BUSINESS WIREKeysight Technologies, Inc. and Synopsys, Inc. introduced an AI-powered RF design migration flow to expedite migration from TSMC’s N6RF+ process to N4P technology, to address the performance requirements of today’s most demanding wireless integrated circuit applications.
AMD Acquires Brium to Strengthen Open AI Software Ecosystem
06/05/2025 | AMDAt AMD, we’re committed to building a high-performance, open AI software ecosystem that empowers developers and drives innovation. Today, we’re excited to take another step forward with the acquisition of Brium, a team of world-class compiler and AI software experts with deep expertise in machine learning, AI inference, and performance optimization.
Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems
06/05/2025 | Cadence Design Systems, Inc.Cadence announced IP, design solution, and expert design services for software and Systems-on-Chip (SoCs) based on Arm® Zena™ Compute Subsystems (CSS), Arm’s first-generation CSS for automotive.
L3Harris Receives Contract to Develop Next-Generation Security Processor for US Government
06/02/2025 | L3Harris TechnologiesL3Harris Technologies has been awarded a contract by the U.S. government to develop a next-generation security processor to secure communication devices across the globe.
Hon Hai Research Institute Partners with Taiwan Academic Research Institute and KAUST to Participate in CLEO 2025
05/30/2025 | FoxconnThe research team of the Semiconductor Division of Hon Hai Research Institute, together with the research teams of National Taiwan University and King Abdullah University of Science and Technology in Saudi Arabia, has successfully made breakthroughs in multi-wavelength μ -LED technology to achieve high-speed visible light communication and optical interconnection between chips.