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Advanced Electronics Packaging Digest

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SIA Commends CHIPS Awards to Accelerate Advanced Compute Semiconductor R&D

07/30/2026 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding seven R&D awards announced by the CHIPS Research and Development Office (CRDO) to accelerate semiconductor R&D for the advanced compute supply chain.

Astro Digital Selects Everspin 64Mb STT-MRAM for GEO Satellite

07/29/2026 | BUSINESS WIRE
Everspin Technologies, Inc., the world's leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) solutions, announced that Astro Digital has selected Everspin’s PERSYST 64Mb STT-MRAM for use on an upcoming Raven bus geosynchronous Earth orbit (GEO) satellite mission.

Qnity Strengthens Long-Term Innovation and Advanced Packaging Roadmap

07/29/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced it is accelerating investments in next-generation technologies through access to a broad portfolio of research programs.

Marvell Invests $250M in India to Expand AI Development

07/29/2026 | BUSINESS WIRE
Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced plans to invest $250 million in India over the next three years to expand its capabilities across technology, talent and infrastructure.

Axcelis Announces Successful Purion XEmax Eval Closure at Leading Semiconductor Foundry

07/28/2026 | PRNewswire
Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced the successful Purion XEmax™ high energy implanter evaluation closure at a leading foundry.
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