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ASTC 2023 Opens Tomorrow With Focus on MEMS and Sensors Growth Applications
January 16, 2023 | SEMIEstimated reading time: 1 minute
Cutting-edge innovations across an explosion of MEMS and sensors applications will take center stage at Advanced Semiconductor Technology Conference (ASTC) starting tomorrow as industry leaders and visionaries gather for insights into the latest technology developments and market trends. Registration is open for the 17-18 January conference and exhibition at Theatre@illuminITE College Central in Singapore.
Themed Connecting Electronics and the Real World, ASTC 2023 will focus on growth applications across MEMS and sensors segments including automotive, consumer electronics, healthcare, mobile, industrial and Internet of Things (IoT). The event will highlight opportunities and challenges in design, manufacturing and integration.
“New sensor technologies are changing the dynamics in electronics manufacturing,” said Linda Tan, president of SEMI Southeast Asia. “Technology advancements are dramatically reducing the size and weight of many components while maintaining power and cost profiles to give rise to new, compelling applications that are changing the way we work and live. ASTC 2023 will delve into the latest technologies as we continue to support the semiconductor ecosystem around the region.”
ASTC 2023 is hosted by SEMI Southeast Asia and SEMI MEMS & Sensors Industry Group (MSIG), a SEMI Technology Community that promotes MEMS and sensors innovations critical to smart devices and brings together technologists and business leaders to collaborate, innovate, and help grow the global MEMS and sensors industry.
ASTC 2023 Highlights:
- Conference will feature industry thought leaders who will offer perspectives on industry trends as well as networking and other information-sharing opportunities.
- Exhibition will showcase the latest MEMS and sensors technologies and innovations.
- Young Emerging Leaders Award will recognize the next generation of innovative and creative industry leaders.
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