Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Arlon Appoints Jason Maupin as COO
January 18, 2023 | Arlon EMDEstimated reading time: 1 minute
Arlon announced the addition of Jason Maupin as Chief Operating Officer. In this role Mr. Maupin will oversee Arlon’s specialty materials business as well as EMC’s laminate distribution business in N. America. This hiring move is the result of Arlon’s current President, Brad Foster announcing his intent to retire in early 2023, after 21 years with Arlon.
“Hiring Jason is a very good move for the organization. He brings sound business practices, industry knowledge, and strong leadership skills to Arlon. These will be needed as Arlon and EMC look to grow business in N. America.”, commented Mr. Foster.
Mr. Maupin brings to Arlon over 25 years of electronics industry experience. He comes to Arlon from Dymax Corporation, where he was the Chief Commercial Officer. Before that, Mr. Maupin was Regional President of Enthone, a specialty chemical provider to the printed circuit, semi-conductor and general metal finishing industries. Prior to entering the commercial sector, Mr. Maupin was in the US Navy from 1991-1996, where he served on the Fast Attack submarine USS Jefferson City.
“As a result of EMC’s acquisition, Arlon is now uniquely positioned in N. America to leverage product portfolios, R&D capabilities, and the financial strength of EMC to rapidly introduce new products, expand Arlon’s capacity, and upgrade manufacturing. These advancements will enable Arlon to increase product offerings into core customers as well as expand globally into other markets. This is an exciting opportunity to combine two truly unique organizations and offer the best of both to OEM and fabricator customers”, stated Mr. Maupin.
About Arlon: Arlon EMD is a US manufacturer of specialty materials. Arlon has supplied materials for the North American, UK, European, Israeli and Asian markets for more than 35 years from their manufacturing location in Rancho Cucamonga, California.
About EMC: Elite Material Co. Ltd. (EMC), established in 1992 as a copper clad (CCL) and prepreg manufacturer, has become the global leader in the manufacture and supply of Halogen free CCL materials. Elite’s highly skilled Research & Development team has developed a family of materials from mid-loss to extreme low loss products. These materials are designed in complex PCB’s; mSAP, IC substrate, high layer count (HLC)/ high speed digital (HSD) and radio frequency (RF) products.
Share on:
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.