Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
Isola Shows Halogen-Free PCBs at DesignCon 2023
January 26, 2023 | Isola GroupEstimated reading time: 2 minutes
Isola Group, a global leader in advanced circuit materials for printed-circuit boards (PCBs), is inviting exhibition visitors to learn more about halogen-free PCBs at DesignCon 2023. Visitors to Isola’s exhibition Booth 627 can discover how unmatched [AI1] levels of electrical performance are possible with a new trio of halogen-free circuit materials. DesignCon 2023, scheduled for January 31-February 2, 2023 in the heart if Silicon Valley, in the Santa Clara Convention Center (Santa Clara, CA), is the major conference and exhibition for high-speed communications and systems design and development.
Isola Group will be unveiling its latest TerraGreen® low-loss circuit materials: TerraGreen® 400G, TerraGreen® 400GE, and TerraGreen® 400G2. The circuit materials incorporate advances to Isola’s existing TerraGreen® standard halogen-free circuit materials and TerraGreen® (RF/MW) halogen-free circuit materials for RF and microwave circuit applications. The new TerraGreen® circuit materials are based on selected glass fibers and ultra smooth copper materials to form ultra-low-loss[AI2] circuit materials ideal for high-speed-digital (HSD) and high-frequency analog circuits typically used to interconnect wired and wireless communications equipment and networks.
Because they are RoHS-compliant for use with lead-free circuit manufacturing processes and compatible with FR-4 circuit material manufacturing processes, they are well suited for producing cost-effective hybrid, mixed-signal circuits. The three new TerraGreen® materials all feature glass transition temperature (Tg) of +200°C and decomposition temperature (Td) of +380°C.
Isola Group’s Chief Sales and Marketing Officer, Sean Mirshafiei, explains: “We are very excited to offer the PCB industry our three new products that were created with a unique halogen-free resin system that has outstanding CAF and bond line resistance.” He added: “TerraGreen® 400G2 is our most advanced High Speed Digital product. We use ultra smooth copper foil and ultra low Dk glass fabric that are combined with this novel resin system for optimal performance for the next generation of high-end network and communication systems.”
The three new TerraGreen® circuit materials deliver outstanding stability with temperature and frequency, maintaining constant permittivity (Dk) and loss tangent (Df) at temperatures from -55 to +125°C. They are capable of even less loss than the company’s popular Tachyon® 100G circuit materials at 28 GHz. For example, TerraGreen® 400G exhibits typical Dk of 3.1 at 5, 10, and 20 GHz with typical loss tangent of 0.0018 at the same three evaluation frequencies. TerraGreen® 400GE halogen-free circuit laminates offer higher Dk of 3.4 at 10 and 20 GHz with slightly greater loss, with typical Df of 0.0026 at 10 and 20 GHz. The lowest-loss material of the halogen-free trio, TerraGreen® 400G2, features typical Dk of 3.1 at 5, 10, and 20 GHz with typical Df of 0.0015 at the same three frequencies.
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.