Cadence Quantus FS Solution Achieves Certification for Samsung Foundry’s SF4, SF3E, SF3 Process Technologies
January 26, 2023 | Cadence Design Systems, Inc.Estimated reading time: 1 minute

Cadence Design Systems, Inc. announced that Samsung Foundry has certified the Cadence Quantus FS solution for its SF4, SF3E and SF3 process technologies. During the Samsung Foundry certification process, the Quantus FS solution successfully demonstrated improved accuracy (tighter mean and standard deviation) versus foundry criteria, ensuring customers can achieve optimal design accuracy and performance. In addition, the certification included verification of capacitance and resistance of BEOL and FEOL, wire via resistance variation and litho bias modeling. Customers can immediately deploy the Quantus FS solution—for library IP characterization, AMS and interface IP, sensors, high-frequency analog and mixed-signal designs, and critical nets in all custom/analog designs—and sign off with confidence.
Included with Cadence’s Quantus Extraction Solution, the Quantus FS solution is a random-walk field solver, utilizing a massively parallel architecture that handles the largest designs, provides faster throughput and linearly scales up to 1000s of CPUs. The built-in 3D capacitance field solver is cloud-ready and production-proven, offering a flexible, scalable modeling platform that enables faster implementation of the Samsung Foundry’s advanced process technologies such as SF4, SF3E and SF3. The Quantus Extraction Solution and the Quantus FS solution are part of Cadence’s broader digital full flow and support the Cadence Intelligent System Design™ strategy, enabling system-on-chip (SoC) design excellence.
“Our continued collaboration with Cadence has focused on delivering novel technologies to our mutual customers at advanced process technologies,” said Sungjae Lee, vice president of the Design Enablement team at Samsung Foundry. “Cadence’s understanding of the complex Gate-All-Around (GAA) modeling features combined with its deep engineering expertise, agility and collaborative approach is very complementary to our own approach in working with our customers. Cadence delivered on all of our accuracy and performance requirements, demonstrating tighter correlation with our golden reference data in a timely manner.”
“The best way to support our customers is to bring innovative products to market that provide efficiencies and speed time to market,” said Vivek Mishra, corporate vice president in the Digital and Signoff Group at Cadence. “We collaborated with Samsung Foundry during the initial technology development process to ensure all the requirements were met and implemented in the Quantus FS solution for easy, early customer adoption of the process technologies. The successful completion of the certification process is a win-win for Samsung Foundry and Cadence as well as for our mutual customers.”
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Circuit Check Acquires Solution Sources Programming (SSP) to Become a Full-Service Test and Programming Provider with Expanded Presence in Silicon Valley
08/05/2025 | PR NewswireCircuit Check, a global leader in turnkey functional test systems across medical, automotive, industrial, military/aerospace, and emerging AI applications, today announced the acquisition of Solution Sources Programming (SSP), a trusted Silicon Valley provider of integrated test and programming solutions for over 35 years.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.
Setting Design Constraints Effectively
07/31/2025 | Stephen V. Chavez, Siemens EDAPCB design requires controlling energy within the medium of a PCB. The manner in which we control the chaos of energy is by implementing and utilizing physical and electrical rules, known as constraints, along with a specific structure and material(s) that make up what is known as the foundation of the design. These rules govern everything within the PCB structure and generally fall into two camps: performance and manufacturability. Setting this foundation correctly is extremely important and the key to success.
MacDermid Alpha Electronics Solutions Unveils Unified Global Website to Deepen Customer, Talent, and Stakeholder Engagement
07/31/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, the electronics business of Elements Solutions Inc, today launched macdermidalpha.com - a unified global website built to deepen digital engagement. The launch marks a significant milestone in the business’ ongoing commitment to delivering more meaningful, interactive, and impactful experiences for its customers, talent, and stakeholders worldwide.
Ansys 2025 R2 Enables Next-Level Productivity by Leveraging AI, Smart Automation, and Broader On-Demand Capabilities
07/30/2025 | PRNewswireAnsys, now part of Synopsys, announced 2025 R2, featuring new AI-powered capabilities across the portfolio that accelerate simulation and expand accessibility.