Meyer Burger, NorSun Conclude Contract for Long-term Supply of Solar Silicon Wafers Made in Europe
February 8, 2023 | Meyer BurgerEstimated reading time: 1 minute

Meyer Burger Technology AG has signed a supply agreement for silicon wafers with the manufacturer NorSun. Meyer Burger is thus strengthening the resilience of its supply chains as it expands its solar cell and module production to 3 gigawatts (GW) of annual capacity by 2024. With the support of the EU Green Deal Industrial Plan, Meyer Burger and NorSun have a strong intention to continue building the European solar value chain.
“The agreement with NorSun is an important step in strengthening the independence of European supply chains,” says Gunter Erfurt, CEO at Meyer Burger. “Further growth at Meyer Burger continues to meet sustainability standards in the future – in technological, social, environmental and economic terms.” The increased use of solar wafers from European production further reduces the CO2 footprint of the high-performance solar modules, as environmentally friendly and cost-effective electricity primarily from hydropower is used for the energy-intensive production of the wafers.
“We in NorSun are very pleased to sign up for this significant volume and share the long-term ambition of Meyer Burger to build a competitive European PV solar value chain. The contract fits well with our strategy to expand the capacity of NorSun. NorSun’s ambition, as the leading PV wafer producer in the western world, is to play a central part in the U.S. and European effort to rebuild the PV value chain. It is exciting to go this route with a recognized player like Meyer Burger,” says Erik Løkke-Øwre, CEO of NorSun.
Suggested Items
Growing Demand for Mid-Size Displays Opens New Opportunities for FMM-Free OLED Technologies
06/05/2025 | TrendForceTrendForce’s latest report on the display industry reveals that OLED technology—valued for its self-emissive structure, high contrast ratio, and lightweight design—continues to expand its market presence, primarily in small-size applications such as smartphones.
Würth Elektronik and HKSTP Sign New Engineering Service Program
06/05/2025 | Wurth ElektronikWürth Elektronik and the Hong Kong Science and Technology Parks Corporation (HKSTP) have signed a comprehensive cooperation agreement to promote development and production in Hong Kong. Around 100 start-ups and Small and Midsized Enterprizes (SMEs) in the field of microelectronics, as well as Hong Kong's entire production ecosystem, will benefit from local development support, knowledge transfer, and partner network of the well-known component manufacturer.
Orbel Corporation Integrates Schmoll Direct Imaging
06/04/2025 | Schmoll AmericaOrbel Corporation in Easton, PA, proudly becomes the first PCM facility in the U.S. equipped with Schmoll’s MDI Direct Imaging system. This installation empowers Orbel to support customers with greater precision and quality.
STARTEAM GLOBAL Unveils Innovative Additive Solder Mask Process
06/02/2025 | STARTEAM GLOBALSTARTEAM GLOBAL, a leading PCB manufacturer, has introduced a revolutionary additive solder mask process at its Flero STARTEAM (FST) factory in Italy, leveraging digital inkjet technology to enhance production efficiency and sustainability.
Global Smart Manufacturing Market Size to Reach $787.54 Billion by 2030
06/02/2025 | PRNewswireThe global Smart Manufacturing Market Size is projected to be valued at USD 297.20 billion in 2023 and reach $787.54 billion by 2030, growing at a CAGR of 14.9% according to a new report by The Research Insights.