Cadence Delivers 13 New VIP and Expands System VIP Portfolio
February 17, 2023 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes

Cadence Design Systems, Inc. announced the availability of 13 new Verification IP (VIP) solutions that enable engineers to quickly and effectively verify their designs to meet the specifications for the latest standards protocols. The new Cadence® VIP offerings empower customers to confidently develop their next-generation automotive, hyperscale data center and mobile SoCs and microcontrollers while keeping pace with the latest industry standards, including Arm® AMBA® 5 CHI-f, Universal Chiplet Interconnect Express™ (UCIe™), GDDR7, DDR5 DIMM, MIPI® A-PHY® and SoundWire® I3S, and USB4 2.0 interfaces.
The new Cadence VIP offer customers a comprehensive verification solution for the most complex protocols. Cadence customers have access to a consistent application programming interface (API) across all VIP with complete bus function models (BFMs), integrated protocol checks and coverage models, facilitating rapid adoption. The VIP support multiple application areas and specifications, including:
Hyperscale data center:
- UCIe
- AMBA 5 CHI-f
- DTI
- Latest version of DDR5 DIMM
Automotive:
- MIPI A-PHY 1.1
- CAN XL
- Flash ONFI 5.1
Consumer and mobile:
- USB4 2.0
- GDDR7
- MIPI SoundWire I3S (SWI3S)
- Latest version of LPDDR
- DFI
- HDMI 2.1
All Cadence VIP solutions include Cadence TripleCheck™ technology, which provides users with a specification-compliant verification plan linked to comprehensive coverage models and a test suite to ensure compliance with the interface specification. The new VIP also support the expanded Cadence System-Level Verification IP (System VIP), which provides SoC-level test libraries, performance analysis, and data and cache coherency checkers. Using the expanded System VIP portfolio, customers can experience up to 10X efficiency improvements compared to a manual process for SoC verification.
“The Cadence memory VIP is a critical part of our verification process and instrumental in the successful deployment of our memory PHY IP,” said Ricky Lau, co-founder and CTO of The Six Semiconductor Inc. “Cadence continues to deliver new VIP offerings and advanced SoC verification technologies that support the latest standards. The Cadence VIP offerings have significantly reduced our development time and increased the confidence of our customers.”
“As requirements evolve and demand increases for higher bandwidth, lower power and more effective cache coherency management, new protocols arrive to address these issues,” said Paul Cunningham, senior vice president and general manager of the System & Verification Group at Cadence. “With these 13 new VIP, Cadence is offering customers solutions to ensure the designs comply with the standard specifications as well as application-specific timing, power and performance metrics, providing the fastest path to IP and SoC verification closure.”
The new VIP solutions are part of the broader Cadence verification full flow, which includes Palladium® Z2 emulation, Protium™ X2 prototyping, Xcelium™ simulation, the Jasper™ Formal Verification Platform, the Helium™ Virtual and Hybrid Studio, and the Verisium™ AI-Driven Verification Platform. The Cadence verification full flow delivers the highest verification throughput of bugs per dollar invested per day.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Register Now for the HATS²™ Technical Day at GEN3 HQ
08/05/2025 | GEN3GEN3 a world-leading manufacturer of testing, measurement and production solutions for electronics reliability. Headquartered in Farnborough, UK, GEN3 is announcing the final call for registrations to attend the exclusive HATS²™ Technical Day — a hands-on, live demonstration event showcasing the Highly Accelerated Thermal Shock Tester (HATS²™), the groundbreaking innovation from industry pioneer Bob Neves.
UHDI Fundamentals: UHDI Technology and Industry 4.0
08/05/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. This article explores the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
BAE Systems' Growing Partnership in Norway
08/04/2025 | BAE SystemsAs two of Europe’s leading defence companies, BAE Systems and Kongsberg are already working together in a number of areas to support militaries across NATO and its wider group of allies.
Technica to Host Demo Days Event August 13-14
08/04/2025 | Technica USATechnica USA is proud to announce its upcoming Demo Days Event, taking place August 13–14 at the company’s Demo Center in San Jose, California. The event will feature live demonstrations and presentations from key supply partners ESSEMTEC, INOVAXE, and PARMI showcasing the latest innovations in SMT manufacturing and automation technology.
Federal Electronics Mexico Enhances SMT Line with Installation of Heller Industries Reflow Oven
08/01/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has enhanced its surface mount technology (SMT) operations with the installation of a new Heller Industries reflow oven at its facility in Hermosillo. This upgrade supports the company’s continued growth in high-reliability markets such as aerospace, medical, industrial, and instrumentation.