Indium Corporation Features Metal Thermal Interface Materials for Burn-In and Test at TestConX

Estimated reading time: 1 minute

Indium Corporation will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, March 5-8 in Mesa, Ariz., U.S.

As an industry leader in high-performance metal thermal interface materials (TIMs), Indium Corporation will feature selections from its portfolio of innovative high-performance metal TIM solutions.

Indium Corporation’s indium-containing TIMs for burn-in and test offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK. Its indium-containing TIMs are available as pure indium, indium-silver alloys, and indium-tin, among others. The pure indium TIM can be clad with a thin aluminum layer on the side facing the device under test (DUT) to prevent the indium from adhering to the surface. Indium Corporation’s suite of Heat-Spring® solutions, featuring a compressible interface between a heat source and a heat-sink, include:

Heat-Spring® Preforms

• Patterned to optimize contact with non-planar surfaces delivering 86W/mK
• Provides uniform contact between the burn-in head and the DUT
• Provides more uniform thermal conductivity
• Cleans with no residue
• Recyclable and reclaimable

Heat-Spring® HSK

• Recommended specifically for burn-in applications where multiple insertions are required
• Provides uniform contact with low resistance for high-density heat loads
• Typically clad with a thin diffusion barrier, which serves as the contact surface for burn-in and test applications
• No staining or cracking

Heat-Spring HSD

• Designed for interfaces with tight surface control >30psi
• Recommended for small, well-designed interfaces with flat, smooth, parallel surfaces