KIOXIA, HPE Team Up to Send SSDs into Space, Bound for the International Space Station
February 27, 2023 | Business WireEstimated reading time: 2 minutes

KIOXIA America, Inc. announces its proud participation in the Hewlett Packard Enterprise (HPE) Spaceborne Computer-2 (SBC-2) program. As part of the program, KIOXIA SSDs provide robust flash storage in HPE Edgeline and HPE ProLiant servers in a test environment to conduct scientific experiments aboard the International Space Station (ISS).
The HPE Spaceborne Computer-2, the first in-space commercial edge computing and AI-enabled system to run on the ISS, is part of a greater mission to significantly advance computing and reduce dependency on communications as space exploration continues to expand. For example, astronauts can achieve increased autonomy by processing data directly on the ISS, eliminating the need to send raw data to Earth to be processed, analyzed and sent back to space.
Designed to perform various high-performance computing tasks in space, including real-time image processing, deep learning, and scientific simulations, the HPE SBC-2 utilizes a combination of HPE’s edge computing solutions, including the HPE Edgeline Converged Edge System, a rugged and compact system, and the HPE ProLiant server for high-performing capabilities. The HPE SBC-2 targets a range of workloads and has already helped advance progress in healthcare, image processing, natural disaster recovery, 3D printing, 5G, AI, and more. As a sponsor of the HPE SBC-2, KIOXIA has provided flash-based SSDs, including KIOXIA RM Series Value SAS and KIOXIA XG Series NVMe™ SSDs, to enable these solutions. These flash-based SSDs are better-suited than traditional hard disk drive storage to withstand the power, performance and reliability requirements of outer space, as they have no moving parts, are less susceptible to electromagnetic waves and provide faster performance.
“Proving that data center-level compute processing can successfully operate in the harsh conditions of space will truly take something special,” noted Scott Nelson, executive vice president and chief marketing officer for KIOXIA America, Inc. “The synergies that exist when KIOXIA and HPE collaborate to leverage our respective technologies, allows us to explore and study at the very edge of scientific discovery. We can’t wait to see where the HPE Spaceborne Computer journey takes us.”
KIOXIA has been collaborating with HPE to create best-in-class storage solutions for years, and the company’s products enable a broad range of HPE solutions, from mobile to data center to enterprise. Value SAS SSDs are part of the KIOXIA Life After SATA campaign, enabling customers to easily transition away from aging SATA SSDs, while delivering higher performance and reliability.
“It is an exciting time for Hewlett Packard Enterprise as we continue to play an important role in the expanding space economy. We are pleased to continue our longstanding collaboration with KIOXIA and partner together on our space computing initiatives to bring its storage solutions to the International Space Station with us,” said Jim Jackson, Chief Marketing Officer, at HPE. “By bringing KIOXIA’s expertise and its SSDs, one of the industry’s leading NAND flash capabilities, with HPE Spaceborne Computer-2, together we are pushing the boundaries of scientific discovery and innovation at the most extreme edge.”
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Marcy’s Musings: Advancing the Advanced Materials Discussion
09/17/2025 | Marcy LaRont -- Column: Marcy's MusingsAs the industry’s most trusted global source of original content about the electronics supply chain, we continually ask you about your concerns, what you care about, and what you most want to learn about. Your responses are insightful and valuable. Thank you for caring enough to provide useful feedback and engage in dialogue.
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Element Solutions Declares Q3 Dividend of $0.08 Per Share
08/22/2025 | BUSINESS WIREElement Solutions Inc announced that its board has declared a quarterly cash dividend of $0.08 per share of the company's common stock. The declared dividend will be paid on September 15, 2025 to stockholders of record as of the close of business on September 2, 2025.
Polymatech Electronics Limited Announces Completion of PCB Manufacturing Facility in Europe
08/15/2025 | PR NewswirePolymatech Electronics Limited is thrilled to announce the successful commissioning of its state-of-the-art Printed Circuit Board (PCB) manufacturing facility in Estonia, Europe. This milestone represents a significant advancement in the company's strategic expansion across the European market.