The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Northrop Grumman’s New Multifunction Sensor Designed for Rapid Production
February 28, 2023 | Northrop GrummanEstimated reading time: 1 minute
Northrop Grumman Corporation has successfully moved its first Electronically-Scanned Multifunction Reconfigurable Integrated Sensor (EMRIS), a new ultra-wideband sensor, into integration and test. Northrop Grumman’s sophisticated multifunction sensors, including EMRIS, enable warfighters to accelerate decision timelines and act collectively.
“The sensor’s architecture is easily scaled and reconfigurable, including a variety of mounting configurations, for a wide applicability across platforms and domains,” said Krys Moen, vice president, advanced mission capabilities, Northrop Grumman. “By developing EMRIS in an open-architecture construct, we can rapidly add new or improved capabilities to increase performance while avoiding redesign. This supports decades of fielded use and continued access to industry best-in-class capabilities for the warfighter.”
EMRIS’s fully digital Active Electronically Scanned Array (AESA) utilizes technology from the Defense Advanced Research Projects Agency Arrays on Commercial Timescales (ACT) program combined with government open-architecture standards. By applying the flexibility of a digital AESA, EMRIS can perform functions including radar, electronic warfare and communications simultaneously.
Multifunction apertures consolidate multiple functions into a single sensor, decreasing both the number of apertures needed and the size, weight and power requirements for the advanced capabilities. Sophisticated multifunction apertures like EMRIS can deploy several functions simultaneously. As part of EMRIS’s integration and test phase, Northrop Grumman is demonstrating the ability to quickly leverage technology developed for other programs to adapt multiple fielded capabilities into EMRIS.
EMRIS was designed using common building blocks and software containerization allowing for rapid, cost-effective production. The sensor’s design leverages commercial processes and materials, including 5G tech base, driving down cost and increasing the quality and reliability of the components.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Firefly Aerospace Announces Strategic Acquisition of SciTec to Advance National Security Capabilities
10/07/2025 | Firefly AerospaceFirefly Aerospace, a market leading space and defense technology company, has entered into a definitive agreement to acquire SciTec, Inc., a leader in advanced national security technologies, for approximately $855 million through a combination of $300 million in cash and $555 million in Firefly shares issued to SciTec owners at a price of $50 per share.
Highlights from the IMAPS Onshoring Advanced Packaging Workshop in Washington, D.C.
09/30/2025 | Marcy LaRont, I-Connect007IMAPS and the Global Electronics Association co-hosted the Onshoring Advanced Packaging and Assembly Workshop in Washington, D.C., in early September. Government leaders, including those from the Department of Defense, attended and were directly involved in organizing the content of the sessions. Jim Will, director of the U.S. Partnership for Assured Electronics, speaks about his role in the event.
UHDI Fundamentals: UHDI Technology and Quality 5.0
09/18/2025 | Anaya Vardya, American Standard CircuitsThe convergence of ultra-high density interconnect (UHDI) technology and Quality 5.0 represents a transformative leap in electronics design and manufacturing. UHDI enables extreme miniaturization and enhanced performance, while Quality 5.0 delivers adaptive, intelligent human-centric quality systems. Together, they set the foundation for advanced electronics that are smarter, more resilient, and more sustainable.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
09/02/2025 | Dennis Fritz -- Column: Defense Speak InterpretedIn my May column, I examined the topic of the CHIPS Act and its current status as a U.S. government program. I found that CHIPS activities continue, but some corporations have delayed or canceled them because of budget cuts or corporation-specific problems. However, CHIPS integrated circuits—mostly administered by the Department of Commerce—don’t fully drive the electronics interconnection activity being funded by the government. Let’s cover the progress/status of other programs: